11..66 xx 11..66 xx 00..66mmmm RReedd && PPuurree ggrreeeenn SSMMDD OSRP0603C1C Ver.A.1 Features Outline Dimension Bi-Color Back view Top view Side view Super high brightness of surface mount LED Water Clear Flat Mold Compact package outline PG Red (LxWxT) of 1.6mm x 1.6mm x 0.6mm Compatible to Reflow soldering. Notes: 1. All dimensions are in Applications Cathode mark millimeters 2. Tolerance is 0.10 mm unless Backlighting (switches, keys, etc.) otherwise noted. Side view Marker lights (e.g. steps, exit ways, etc.) Absolute Maximum Rating ((TTaa==2255)) ((TTaa==2255)) Directivity Symbo Value 0 Item Unit l Red PG DC Forward Current I mA 30 30 F Pulse Forward Current* I mA 100 100 FP Reverse Voltage V V 5 5 R 0 Power Dissipation mW P 78 108 D Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 260/5sec - *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((((TTTTaaaa====22225555)))) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =5mA V =5V I =5mA F R F Red HR 1.6 2.0 2.4 10 25 50 70 620 625 635 120 OSRP0603C1C Pure green PG 2.6 3.0 3.4 10 80 120 200 515 525 530 120 Note: * Vf tolerance: 0.05V * Dominant wavelength tolerance: 1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:10% LED & Application Technologies 11..66 xx 11..66 xx 00..66mmmm RReedd && PPuurree ggrreeeenn SSMMDD OSRP0603C1C Recommended Soldering Temperature Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies