K-CNM-0000-BONE PacTec

K-CNM-0000-BONE electronic component of PacTec Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of K-CNM-0000-BONE across the USA, India, Europe, Australia, and various other global locations. K-CNM-0000-BONE are a product manufactured by PacTec. We provide cost-effective solutions for K-CNM-0000-BONE, ensuring timely deliveries around the world.

Part No. K-CNM-0000-BONE
Manufacturer: PacTec
Category: Unclassified
Description: KCNM0000BONE pactec
A 10 compartment modular magnetically-coupled combo box designed to store and transport bones.
Datasheet:
Price (USD)
10: USD 4.6211 ea
Line Total: USD 46.21 
Availability : 0
  
QtyUnit Price
10$ 4.6211
20$ 4.2997

Availability 0
Ship by Fri. 17 Oct to Thu. 23 Oct
MOQ : 10
Multiples : 1
QtyUnit Price
10$ 4.6211
20$ 4.2997

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Packaging
Brand
Factory Pack Quantity :
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the K-CNM-0000-BONE from our PacTec manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the K-CNM-0000-BONE and other electronic components in the PacTec manufacturer and beyond.

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Inc. K-CNM-0000-BONE is a compliant, printed circuit board (PCB) backplane system designed and manufactured by PacTec Inc. It is designed for applications requiring high-performance, high-speed data transfer and low power consumption. The system features a 2-layer flex-rigid structure with surface mount technology components, such as FPGAs, ASICs, and microcontrollers. It features two connectors, 34 slots, two separate power supplies, and two separate shielded ground planes. It is capable of transferring data at speeds of up to 500 Mbps, and has a high-temperature resistance range of up to 260°C. The system is also RoHS compliant, making it an ideal choice for industrial applications.

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