Product Information

ECC-T3F270JG

ECC-T3F270JG electronic component of Panasonic

Datasheet
27 pF ±5% 3000V (3kV) Ceramic Capacitor SL/GP Nonstandard SMD

Manufacturer: Panasonic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 2000
Multiples : 2000

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ECC-T3F270JG
Panasonic

2000 : USD 0
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

Stock Image

ECC-T3F270JG
Panasonic

1 : USD 1.4613
10 : USD 1.1524
N/A

Obsolete
0 - WHS 3


Multiples : 1

Stock Image

ECC-T3F270JG
Panasonic

N/A

Obsolete
     
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RoHS - XON
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High Voltage Ceramic Capacitors (SMD) High Voltage Ceramic Capacitors For Surface Mounting 1 to 5 kVDC Features Recommended Application Resin molded SMD type for re ow solderings Ballast circuit of LCD backlighting inverter High reliability through use of disc capacitor element (For 3 to 5 kVDC Char.SL/GP) Wide rated voltage ranges from 1 kV to 5 kV, through a Snubber circuit of switching power supply disc element which withstand high voltage and outcurve (For 1 to 2 kVDC Char.B/Y5P) terminals Wide rated voltage range 1 to 5 kV Explanation of Part Numbers 1 23456789 10 11 12 E C C T3F4 7 0 J G Nominal Capacitance Product Code Packaging Style Rated Voltage Cap. Tolerance Temp. Char. Suffix Ex. Capacitance Code Class Code Style Code Rated Voltage Code Tol. Code Temp. Char. Code Style code 100 10 pF ECC Class1 T Taped type 3A 1 kVDC D 0.5 pF G SL/GP Nil 1 470 47 pF ECK Class2 3D 2 kVDC J 5% B B/Y5P M 2 101 100 pF 3F 3 kVDC K 10 % 2 3 221 220 pF 3G 4 kVDC M 20 % Y 4 3H 5 kVDC Construction Dimensions in mm (not to scale) Inside Terminal style 1, 3 Electrode Molded Resin SS E L W Ceramic Element Terminal A B Outside Terminal style 2, 4 This Figure applied to L Style Code 2, 4 (Add dim.L1) Electrode Molded Resin L1 Symbol L1 L W H S E A B Style 1 7.10.56.30.3 2.50.3 1.450.30 2.50.2 (2.0) (3.7) Ceramic Element Dim Style 2 10.80.5 6.80.5 6.30.3 2.50.32.50.2(2.0) (3.7) Terminal (mm) Style 3 5.70.54.50.32.3max. 0.850.30 2.50.2 (1.7) (3.1) Style 4 9.40.3 5.50.5 4.50.3 2.30.2 2.50.2 (1.7) (3.1) Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Dec. 2007 HHigh Voltage Ceramic Capacitors (SMD) Speci cations Characteristics Char. SL/GP Char. B/Y5P Operating Temperature Range 25 to 105 C Rated Voltage2 to 3 kVDC 4 to 5 kVDC 5 kVDC 1 to 2 kVDC Dielectric 200 % of Rated Voltage 150 % of Rated Voltage 120 % of Rated Voltage 200 % of Rated Voltage Withstanding Voltage for 1 to 5 seconds for 1 to 5 seconds for 1 to 5 seconds for 1 to 5 seconds Capacitance Within the specied t olerance, when measured Within the specied t olerance, when measured at 1 MHz20 %, 1 to 5 Vrms. and 20 C at 1 kHz20 %, 1 to 5 Vrms. and 20 C Q or Dissipation Factor 30 pF or under Q > 400+20 C (C:Cap.pF) tan < 0.025 (tan ) over 30 pF Q > 1000 at 1 kHz20 %,1 to 5 Vrms. and 20 C at 1 MHz20 %,1 to 5 Vrms. and 20 C Insulation Resistance 10000 M min. at 500 VDC and 1 minute electri cation Temperature Temperature Coefcie nt: Max. Cap. Change:10 % Characteristics +350 to 1000 ppm/ C (Temperature Range : 25 to 85 C) (Temperature Range : 20 to 85 C) Packaging Methods (Taping) Minimum Quantity/Packing Unit Minimum Packing Carton Dimensions Packing Quantity Type Packaging Style Part Number Quantity in Carton in mm L W H 1 to 5 kVDC Embossed Carrier 2000 EC T3 5 to 470 pF 6000 pcs. 350 350 62 pcs./reel (style 1) Taping 5 kVDC Embossed Carrier 2000 ECCT3H M 5 to 27 pF 4000 pcs. 350 350 62 (style 2) Taping pcs./reel 4 kVDC Embossed Carrier 3000 ECCT3G JG2 10 to 27 pF 9000 pcs. 350 350 62 pcs./reel (style 3) Taping 5 kVDC Embossed Carrier 3000 ECCT3H Y 5 to 15 pF 6000 pcs. 350 350 62 pcs./reel (style 4) Taping Reel Embossed Carrier Taping style 1, 3, 4 (W=12 mm) Feeding hole Chip pocket t1 E D0 P2 P0 C A D r t2 Chip component Tape running P1 direction style 2 Feeding hole Chip pocket t1 Wt A D0 P2 P0 A t2 Chip component Tape running P1 direction Unit:(mm) Unit:(mm) Symbol AB C D E W t r Symbol A B W F E P1 P2 P0 D0 t1 t2 style 1, 3 13.51.5 1.5 6.5 7.5 12.0 5.5 1.75 8.0 2.0 4.0 0.3 3.2 style1 +0.1 Dim. 0.2 0.2 0.3 0.1 0.10 0.1 0.1 0.1 0.1 0.3 5 min. 0.5 1.0 0.5 1.5 0.5 style 2 330 60 13.0 21.0 2.0 25.5 2.0 R1.0 0 (mm) 1.5 style 4 17.5 1.5 6.65 11.2 24.0 11.5 1.75 12.0 2.0 4.0 0.3 3.2 style2 +0.1 0.20 0.2 0.3 0.1 0.10 0.1 0.1 0.1 0.1 0.3 0 Dim. (mm) 1.5 4.8 6.0 12.0 5.5 1.75 8.0 2.0 4.0 0.3 2.8 style3 +0.1 0.2 0.2 0.3 0.1 0.10 0.1 0.1 0.1 0.1 0.3 0 1.5 4.7 10.0 16.0 7.5 1.75 8.0 2.0 4.0 0.3 2.85 style4 +0.1 0.2 0.5 0.3 0.1 0.10 0.1 0.1 0.1 0.1 0.30 0 Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Dec. 2007 B B B F E F E W W

Tariff Desc

8532.24.00 43 no --Ceramic dielectric, multilayer Free

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