Product Information

ENW-89820A1KF

ENW-89820A1KF electronic component of Panasonic

Datasheet
Bluetooth Bluetooth v4.0 Transceiver Module 2.4GHz Integrated, Chip Surface Mount
Manufacturer: Panasonic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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2 - Global Stock

MOQ : 1
Multiples : 1

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ENW-89820A1KF
Panasonic

1 : USD 16.458
N/A

Obsolete

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Additional Infomation About Product

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Please refer to chapter 24 / 24.1 Information regarding Software Versions Software Software Version Please refer to chapter 24 / 24.1 Information regarding Software Versions By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Difference PAN1720 / PAN1721 .................................................................................... 4 3. Difference PAN172x / PAN171x .................................................................................... 4 4. Key Features ................................................................................................................. 4 Bluetooth Low Energy ............................................................................................................ 5 5. Applications for the Module ........................................................................................... 5 6. Description for the Module ............................................................................................. 5 7. Detailed Description ...................................................................................................... 6 7.1. PAN172x Terminal Layout ................................................................................... 6 7.2. Crossreference GPIO PAN-Module to BlueRadios-Module .................................. 8 8. Bluetooth Features ........................................................................................................ 9 9. PAN172x Block Diagram ............................................................................................... 9 10. Test Conditions ........................................................................................................... 10 11. General Device Requirements and Operation ............................................................. 10 11.1. Absolute Maximum Ratings ................................................................................ 10 11.2. Recommended Operating Conditions ................................................................. 10 11.3. PAN1720 Current Consumption ......................................................................... 11 12. Bluetooth RF Performance .......................................................................................... 12 12.1. PAN1720 Bluetooth Characteristics ................................................................... 12 12.2. PAN1721 Bluetooth Characteristics ................................................................... 12 12.3. PAN17XX Spurious Emission ............................................................................. 12 13. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13 13.1. For lead solder ................................................................................................... 13 13.2. For leadfree solder ............................................................................................. 13 14. PAN172x Module Dimension ....................................................................................... 14 15. PAN171x Module Dimension ....................................................................................... 15 16. PAN172x FootPrint of the Module ............................................................................... 16 17. PAN171x FootPrint of the Module ............................................................................... 17 18. Case Marking .............................................................................................................. 18 18.1. Example for Marking .......................................................................................... 18 18.2. Marking Definition .............................................................................................. 18 19. Mechanical Requirements ........................................................................................... 18 20. Development of Applications ....................................................................................... 19 21. Reliability Tests ........................................................................................................... 19 22. Cautions ...................................................................................................................... 19 22.1. Design Notes ..................................................................................................... 19 22.2. Installation Notes ................................................................................................ 20 22.3. Usage Conditions Notes ..................................................................................... 20 22.4. Storage Notes .................................................................................................... 21 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

Panasonic may also be referenced as

Aromat
PA4
PAB
PAN
Panasonic - BSG
Panasonic - ECG
Panasonic - SSG
PANASONIC / SUNX
PANASONIC ACCESSORIES
PANASONIC BATTERIES
PANASONIC BATTERY
Panasonic Electric W
Panasonic Electric Works
Panasonic Electronic Components
Panasonic Electronic Components - Semiconductor Products
PANASONIC EW / AROMAT
PANASONIC EW/AROMAT
PANASONIC IMD
PANASONIC IND DEVICES (PIDSA)
Panasonic Industrial Automation Sales
Panasonic Industrial Devices
PANASONIC PIDSMY
Panasonic Semiconductors
PB4

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