EVAL_PAN1760EMK

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1760-2400-102 1.2 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 28 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 20.06.2017 PAN1760 ENW89847A1KF Product Specification Applicant/Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant/Manufacturer Toshiba Software Software Version Please refer to chapter 21 By purchase of any of the products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1760-2400-102 1.2 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 28 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 20.06.2017 PAN1760 ENW89847A1KF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Key Features ................................................................................................................. 4 3. Bluetooth ....................................................................................................................... 4 4. Applications for the Module ........................................................................................... 4 5. Description of the Module .............................................................................................. 5 6. Detailed Description ...................................................................................................... 5 6.1. PAN1760 Terminal Layout ................................................................................... 5 7. PAN1760 Block Diagram ............................................................................................... 7 7.1. ENW89847A2KF .................................................................................................. 7 8. GPIO Function List ........................................................................................................ 8 9. Test Conditions ............................................................................................................. 9 10. General Device Requirements and Operation ............................................................... 9 10.1. Absolute Maximum Ratings .................................................................................. 9 10.2. Recommended Operating Conditions ................................................................... 9 10.3. Power up sequence ........................................................................................... 10 10.4. PAN1760 Current Consumption ......................................................................... 10 11. Bluetooth RF Performance .......................................................................................... 10 11.1. PAN1760 Bluetooth Characteristics ................................................................... 10 12. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 11 12.1. For lead solder ................................................................................................... 11 12.2. For leadfree solder ............................................................................................. 11 13. PAN1760 Module Dimension ...................................................................................... 12 14. PAN1760 Footprint of the Module ............................................................................... 13 15. Case Marking .............................................................................................................. 14 15.1. Example for Marking .......................................................................................... 14 15.2. Marking Definition .............................................................................................. 14 16. Mechanical Requirements ........................................................................................... 14 17. Development of Applications ....................................................................................... 15 18. Reliability Tests ........................................................................................................... 15 19. Cautions ...................................................................................................................... 15 19.1. Design Notes ..................................................................................................... 15 19.2. Installation Notes ................................................................................................ 16 19.3. Usage Conditions Notes ..................................................................................... 16 19.4. Storage Notes .................................................................................................... 16 19.5. Safety Cautions .................................................................................................. 17 19.6. Other cautions .................................................................................................... 17 20. Packaging ................................................................................................................... 18 20.1. PAN1760 Tape Dimension ................................................................................. 18 20.2. Packing in Tape ................................................................................................. 18 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de