Product Information

RP-SEMC16DA1

Product Image X-ON

Datasheet
eMMC 16gb eMMC MC Series itemp 153 ball

Manufacturer: Panasonic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 174.9841 ea
Line Total: USD 174.9841

2 - Global Stock
Ships to you between
Wed. 14 Jun to Tue. 20 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2 - Global Stock


Ships to you between Wed. 14 Jun to Tue. 20 Jun

MOQ : 1
Multiples : 1

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RP-SEMC16DA1
Panasonic

1 : USD 169.6

1 - Global Stock


Ships to you between Wed. 14 Jun to Tue. 20 Jun

MOQ : 1
Multiples : 1

Stock Image

RP-SEMC16DA1
Panasonic

1 : USD 227.4794

     
Manufacturer
Panasonic
Product Category
eMMC
RoHS - XON
Y Icon ROHS
Series
Mc
Memory Size
16 gb
Sustained Read
280 Mb/S
Sustained Write
22 Mb/S
Operating Supply Voltage
2.7 V To 3.6 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Dimensions
11.5 Mm X 13 Mm X 1.4 Mm
Packaging
Bulk
Product
Emmc Flash Drive
Brand
Panasonic
Active Mode Current
-
Factory Pack Quantity :
152
Cnhts
8542319000
Hts Code
8523510000
Product Type
Emmc
Subcategory
Memory Data Storage
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RP-SEMCxxDA1 MC Series eMMC, Industrial MLC Model Product Outline MC series are eMMC (Embedded Multi-Media Card) adopting built-in MLC NAND flash memory, and suitable for industrial applications where embedded reliability (mechanical vibration, shock, etc.) is required. AEC-Q100 (which includes qualification standards by the Automotive Electronics Council) is certificated for this MC series. Product Specificationspecifications and appearances are subject to be changed without notice. 8GB 16GB 32GB Appearance Part Number RP-SEMC08 RP-SEMC16 RP-SEMC32 User data area Capacity 7,818,182,656 byte 15,636,365,312 byte 31,272,730,624 byte capacity JEDEC Standard eMMC 5.0 Compliant Specification Backwards Compatibility with legacy MMC card, Bus Speed Modes High Speed SDR, High Speed DDR, HS200, HS400 Package FBGA153 (153 balls / 0.5 mm pitch) Form Factor Dimensions 11.5 mm x 13.0 mm x Max 1.4 mm 260 MB/s 260 MB/s 260 MB/s Read/Write Read (HS400) (HS400) (HS400) Performance 25 MB/s 22 MB/s 45 MB/s (up to) Write (HS400) (HS400) (HS400) Supply Voltage Min: 2.7 V, Max: 3.6 V for Core (VCC) Power Supply Voltages Supply Voltage Min: 2.7 V, Max: 3.6 V for I/O (VCCQ) Min: 1.7 V, Max: 1.95 V Operating -40 degree C to +85 degree C Temperature Environmental Specification Storage -40 degree C to +85 degree C Temperature Recommended reflow condition JEDEC J-STD-020D.1 / moisture sensitivity: LEVEL 3 Products comply with EU RoHS directives. Page 1 of 2 (2017.09.29) RP-SEMCxxDA1 Package specifications (FBGA153) < Top View > < Bottom View > (Unit: mm) System Reliability a. Powerful error detecting and correcting function b. Dynamic/Static wear leveling c. Data recovery in case of power failure in writing d. Automatic refresh function e. Bad block management Notice and Caution If you think about the usage for which special quality or reliability of the products is needed and failure or malfunction of the products may directly threaten life or injury for the special usage (aeronautic or cosmic usage, military usage, combustion machine, life support applications or safety applications), please counsel with our contacts in advance. Write frequency and storage temperature will affect data retention time. Please make a backup for important data. Warranty If the product cannot be used because of failure which is determined as defect in design or in production of the product, it is replaced by same product or equivalent one within 12 months from the delivery date of product. Page 2 of 2 (2017.09.29)

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
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