PA4340.471ANLT Pulse

SMT Power Inductor High Current Molded Power Inductor - PA4340.XXXANLT Series Height: 3.0mm Max Footprint: 6.0mm x 5.4mm Max Current Rating: up to 18.0A Inductance Range: 0.20uH to 15.0uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux Electrical Specifications 25C - Operating Temperature -55C to +155C DC Saturation Resistance Inductance Rated Current 100KHz, 1V Current MAX. TYP. Max. Part Number uH20% A m m A PA4340.201ANLT 0.20 18.0 2.8 2.5 24.0 PA4340.331ANLT 0.33 16.0 5.4 4.5 12.0 PA4340.471ANLT 0.47 13.5 6.0 5.2 10.0 PA4340.681ANLT 0.68 12.5 8.5 7.4 9.0 PA4340.821ANLT 0.82 10.0 9.2 8.0 8.8 PA4340.102ANLT 1.00 9.0 12.0 10.5 8.5 PA4340.152ANLT 1.50 8.0 15.7 13.6 7.5 PA4340.222ANLT 2.20 7.0 25.0 21.6 6.5 PA4340.332ANLT 3.30 6.3 33.0 28.0 6.0 PA4340.472ANLT 4.70 5.5 44.0 38.0 5.3 PA4340.562ANLT 5.60 5.0 58.0 50.0 4.6 PA4340.682ANLT 6.80 4.3 66.0 57.0 3.5 PA4340.103ANLT 10.0 3.8 103 88.0 2.5 PA4340.153ANLT 15.0 2.9 170 140 2.2 0 SMT Power Inductor High Current Molded Power Inductor - PA4340.XXXANLT Series Notes: 1. Actual temperature of the component during system operation (ambient plus tempera- 3. The rated current is the DC current required to raise the component temperature by ture rise) must be within the standard operating range. approximately 40 C. Take note that the components performanc varies depending on the 2. The saturation current is the current at which the initial inductance drops approxi- system condition. It is suggested that the component be tested at the system level, to mately 30% at the stated ambient temperature. This current is determined by placing verify the temperature rise of the component during system operation. the component in the specified ambient environment and applying a short duration 4. The part temperature (ambient+temp rise) should not exceed 155 C under worst case pulse current (to eliminate self-heating effect) to the component. operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool- ing provisions all affect the part temperature. Part temperature should be verified in the end application. Mechanical PA4340.XXXANLT C A D L A XXXANL E B D/C G T SUGGESTED PAD LAYOUT Final Layout Series A A B C D E T L G H PA4340.XXXANLT 5.70.3 5.20.3 5.20.2 2.80.2 1.00.3 2.00.2 0~0.15 6.0 2.8 2.5 All Dimensions in mm. TAPE & REEL INFO Blank portions Chip cavity Blank portions K P1 200mm or more 400mm or more G Direction of tape SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) TAPE SIZE (mm) QTY A G P W K PCS/REEL 1 0 PA4340.XXXANLT 330 12.4+2/-0 8.00.1 12.00.3 3.30.1 2000