PA4344.132NLT

SMT Power Inductor High Current Molded Power Inductor - PA4344.XXXNLT Series Height: 7.0mm Max Footprint: 17.7mm x 17.2mm Max Current Rating: up to 52.0A Inductance Range: 1.0uH to 100uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux 200Vdc Isolation between terminal and core Electrical Specifications 25C - Operating Temperature -40C to +125C DC Saturation Saturation Resistance Inductance Rated Current 1 Current 2 100KHz, 1V Current MAX. TYP. Max. Max. Part Number uH20% A m m A A PA4344.102NLT 1.0 52.0 2.0 1.6 60.0 70.0 PA4344.132NLT 1.3 49.0 2.3 1.7 54.0 67.0 PA4344.152NLT 1.5 47.0 2.5 2.0 52.0 65.0 PA4344.222NLT 2.2 43.5 2.7 2.4 46.0 62.0 PA4344.332NLT 3.3 28.0 3.9 3.5 45.0 54.0 PA4344.472NLT 4.7 25.0 5.5 4.8 41.0 50.0 PA4344.562NLT 5.6 21.0 7.05 5.8 40.0 45.0 PA4344.682NLT 6.8 19.0 9.2 8.4 32.0 39.0 PA4344.822NLT 8.2 18.0 10.8 9.6 25.0 31.0 PA4344.103NLT 10.0 16.5 13.0 11.8 24.0 29.0 PA4344.153NLT 15.0 12.5 20.5 17.8 23.0 27.0 PA4344.223NLT 22.0 12.0 26.5 25.1 18.0 23.0 PA4344.333NLT 33.0 10.7 44.0 38.0 15.0 20.0 PA4344.393NLT 39.0 9.2 48.0 40.0 11.0 18.0 PA4344.473NLT 47.0 8.7 55.0 48.0 9.5 16.0 PA4344.563NLT 56.0 7.8 62.0 54.0 9.0 15.0 PA4344.683NLT 68.0 7.0 80.0 68.0 8.0 13.0 PA4344.104NLT 100 5.3 118.0 102.0 6.5 12 USA 858 674 8100 Germany 49 2354 777 100 Singapore 65 6287 8998 Shanghai 86 21 62787060 China 86 755 33966678 Taiwan 886 3 4356768 1 pulseelectronics.com P771.D (03/17)SMT Power Inductor High Current Molded Power Inductor - PA4344.XXXNLT Series Notes: 1. Actual temperature of the component during system operation (ambient plus tempera- 4. The rated current is the DC current required to raise the component temperature by ture rise) must be within the standard operating range. approximately 40C. Take note that the components performanc varies depending on the 2. The saturation current 1 is the current at which the initial inductance drops approxi- system condition. It is suggested that the component be tested at the system level, to mately 30% at the stated ambient temperature. This current is determined by placing verify the temperature rise of the component during system operation. the component in the specified ambient environment and applying a short duration 5. The part temperature (ambient+temp rise) should not exceed 125C under worst case pulse current (to eliminate self-heating effect) to the component. operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool- 3. The saturation current 2 is the current at which the initial inductance drops approxi- ing provisions all affect the part temperature. Part temperature should be verified in the mately 40% at the stated ambient temperature. This current is determined by placing end application. the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effect) to the component. Mechanical PA4344.XXXNLT Final Layout SUGGESTED PAD LAYOUT Series A B C D E F G H PA4344.XXXNLT 17.7 Max 17.2 Max 7.0 Max (11.9) (13.1) (12.5) (3.15) (12.2) All Dimensions in mm. TAPE & REEL INFO SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) TAPE SIZE (mm) QTY A B G N E F D P P P W T K PCS/REEL 0 1 0 2 0 PA4344.XXXNLT 330 N/A 32 100 1.75 14.2 1.5 24 4 2 32 0.5 7.5 300 2 pulseelectronics.com P771.D (03/17)