RS2501M THRU RS2507M SINGLE-PHASE GLASS PASSIVATED SILICON BRIDGE RECTIFIER VOLTAGE RANGE 50 to 1000 Volts CURRENT 25 Amperes FEATURES * Low leakage * Low forward voltage * Mounting position: Any * Surge overload rating: 300 amperes peak * Ideal for printed cikcuit boakds RS-25M * High forward surge current capability .189 ( 4.8 ) MECHANICAL DATA .173 ( 4.4 ) * Epoxy: Device has UL flammability classification 94V-O .150 ( 3.8 ) 1.193 ( 30.3 ) * UL list the recognized component directory, file E94233 .134 ( 3.4 ) 1.169 ( 29.7 ) .106 (2.7 ) .096 (2.3 ) .114 (2.9 ) .098 (2.5 ) .087 (2.2 ) .071 (1.8 ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS .043 (1.1 ) .031 (0.8 ) o Ratings at 25 C ambient temperature unless otherwise specified035 (0.9 ) .023 (0.6 ) Single phase, half wave, 60 Hz, resistive or inductive load402 (10.2 ) .303 (7.7 ) .303 (7.7 ) .386 (9.8 ) .287 (7.3 ) .287 (7.3 ) Dimensions in inches and (millimeters) O MAXIMUM RATINGS( T A=25 C unless otherwise noted) RATINGS SYMBOL RS2501M RS2502M RS2503M RS2504M RS2505M RS2506M RS2507M UNITS Maximum Recurrent Peak Reverse Voltage V 50 100 200 400 600 800 1000 Volts RRM Maximum RMS Voltage V 35 70 140 280 420 560 700 Volts RMS V 50 100 200 400 600 800 1000 Volts Maximum DC Blocking Voltage DC Maximum Average Forward Rectified with heatsink 25 O I Amps O Current at T =55 C C without heatsink 4.3 Peak Forward Surge Current 8.3 ms single half sine-wave I 300 Amps FSM superimposed on rated load (JEDEC method) 2 2 Typical Current Squared Time 373.3 I t A S 0 Typical Thermal Resistance (Note 1) R 1.0 C/W 1 JC 0 R 22 Typical Thermal Resistance (Note 1) 1 JA C/W 0 150 Operating Temperature Range T C J 0 Storage Temperature Range T -55 to + 150 C STG O ELECTRICAL CHARACTERISTICS( T A=25 C unless otherwise noted) RS2501M RS2502M RS2503M RS2504M RS2505M RS2506M RS2507M CHARACTERISTICS SYMBOL UNITS Maximum Forward Voltage at 12.5A DC VF 1.1 Volts o TA = 25 C uAmps Maximum DC Average Reverse Current at 5.0 I o R Rated DC Blocking Voltage TA = 125 C 200 uAmps NOTES : 1. Thermal resistance : Heat-sink case mounted. 2014-03 2. Fully ROHS compliant, 100% Sn plating (Pb-free). REV:B .61 5 .(24 ) .917 ( 5) .15 0 (3.8 ) .07(8 18.0 ) .80 30()206 (6 9 17).0 .7 (7591.7 ) .441 )(11.2 . 8425(10. ) f8.13 ( 35. ) 126 . ( 3.2 )RATING AND CHARACTERISTICS CURVES ( RS2501M THRU RS2507M ) 30 60 20 sine wave O O T = 150 C T = 150 C (TYP) C J 50 10 5 40 O T =25 C (TYP) C 2 30 1 20 0.5 10 0.2 Pulse test per one diode 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 4 8 12 16 20 24 INSTANTANEOUS FORWARD VOLTAGE, (V) AVERAGE RECTIFIED FORWARD CURRENT, (A) FIG.1 TYPICAL INSTANTANEOUS FORWARD FIG.2 POWER DISSIPATION CHARACTERITICS 5 300 sine wave 0 4 8.3ms 200 1 cycle non-repetitive Tj=25 on glass-epoxi substrate 3 100 P.C.B 2 soldering land 5mmf sine wave R-load free in air 0 1 1021502050 100 0 40 80 120 160 O NUMBER OF CYCLE AMBIENT TEMPERATURE, ( C) FIG.4 TYPICAL FORWARD CURRENT FIG.3 SURGE FORWARD CURRENT CAPABILITY DERATING CURVE 25 1.2 heatsink Tc Tc with thermal compound 1.0 20 0.8 15 sine wave R-load 0.6 on heatsink 10 0.4 5 0.2 0 0 10 30 50 70 90 110 130 150 170 2 34 5 6 7 8 O HEAT SINK TEMPERATURE, ( C) MOUNTING TORQUE (kg.cm) FIG.5 TYPICAL FORWARD CURRENT FIG.6 CONTACT THERMAL RESISTANCE fcf DERATING CURVE AVERAGE FORWARD CURREANT, () PEAK FORWARD SURGECAU,RRENT () INSTANTANEOUS FORWARD CURRENT, (A) IFSM O THERMAL RESISTANC(E C/W) AVERAGE FORWARD CURRENT, (A) POWER DISSIPATION, (W)