Product Information

F2972NEGK

F2972NEGK electronic component of Renesas

Datasheet
RF Switch ICs High Linearity Broadband SP2T 5MHz to 10GHz

Manufacturer: Renesas
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.1665 ea
Line Total: USD 3.17

4038 - Global Stock
Ships to you between
Wed. 08 May to Fri. 10 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2072 - Global Stock


Ships to you between Wed. 08 May to Fri. 10 May

MOQ : 1
Multiples : 1

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F2972NEGK
Renesas

1 : USD 2.7715
10 : USD 2.2885
100 : USD 2.093
250 : USD 1.932
500 : USD 1.771
1000 : USD 1.5295
3000 : USD 1.495
9000 : USD 1.472

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Number of Switches
Switch Configuration
Insertion Loss
Off Isolation - Typ
Maximum Operating Temperature
Mounting Style
Package / Case
Packaging
Operating Frequency
Minimum Operating Temperature
Series
Packaging
Brand
Operating Supply Current
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Max
Supply Voltage - Min
Cnhts
Hts Code
Mxhts
Taric
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High Linearity Broadband SP2T F2972 Datasheet 5MHz to 10GHz Description Features (75) The F2972 is a single-pole double-throw (SP2T) reflective RF Low insertion loss: switch featuring high linearity and wide bandwidth. This device is 0.23dB at 204MHz optimized from 5MHz to 1.8GHz to support downstream cable 0.34dB at 1.8GHz modem future migration for DOCSIS 3.1 applications, and operates High Isolation: 40dB at 1.8GHz at up to 10GHz to support a multitude of wireless RF applications. P0.1dB compression of +37dBm at 204MHz Superb performance is achieved when used in either 50 or 75 Second Harmonic: -100dBc at 204MHz terminating impedance applications. Third Harmonic: -120dBc at 204MHz The F2972 uses a single positive supply voltage of either +3.3V or Composite Second Order Distortion > 100dBc +5.0V and is compatible with either 1.8V or 3.3V control logic. Composite Triple Beat Distortion > 100dBc Competitive Advantage Features (50) The F2972 provides extremely low insertion loss across the entire Low insertion loss: bandwidth while providing superb distortion performance. 0.40dB at 2.4GHz Optimized for DOCSIS 3.1 applications up to 1.8GHz 0.55dB at 8GHz Optimized for Wi-Fi applications up to 5.9GHz High Isolation: Low insertion loss 34dB at 2.4GHz High isolation High Linearity: Fast switching IIP2 +125dBm at 2.4GHz No external matching required IIP3 +77dBm at 2.4GHz P0.1dB compression of +40dBm at 2.4GHz Second Harmonic: -100dBc at 2.4GHz Typical Applications Third Harmonic: -110dBc at 2.4GHz Broadband cable DOCSIS 3.0 / 3.1 Set top box CATV filter bank switching Block Diagram Wi-Fi Figure 1. Block Diagram Cellular BTS General purpose General Features Supply voltage: +2.5V to +5.25V 1.8V and 3.3V compatible control logic 2mm x 2mm, 12-pin TQFN package 2017 Integrated Device Technology, Inc. 1 Rev O April 19, 2017 F2972 Datasheet Pin Assignments Figure 2. Pin Assignments for 2mm x 2mm x 0.5mm 12-pin TQFN, NEG12 Top View GND RF2 GND 21 11 01 GND 1 V 9 CC RFC 2 EN F2972 8 GND V 3 CTL 7 EP 4 5 6 GND RF1 GND Pin Descriptions Table 1. Pin Descriptions Number Name Description 1 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 2 RFC RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 3 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 4 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 5 RF1 RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 6 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 7 V Logic control pin. CTL Active high enable pin. If low, neither RF1 nor RF2 are connected to RFC. Pin is internally pulled up to 8 EN 2.5V through a 500k resistor. Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as 9 V CC possible to pin. 10 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 11 RF2 RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 12 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple EP ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. 2017 Integrated Device Technology, Inc. 2 Rev O April 19, 2017

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
CEL (RENESAS)
ID4
IDT
IDT, Integrated Device Technology Inc
INTEGRATED DEVICE
INTEGRATED DEVICE TECHNOLOGY
INTEGRATED DEVICES TECH AID
Intersil
INTERSIL - FGC
Intersil(Renes as Electronics)
Intersil(Renesas Electronics)
ITS
REA
RENESAS
RENESAS (IDT)
RENESAS (INTERSIL)
Renesas / IDT
Renesas / Intersil
Renesas Electronics
Renesas Electronics America
RENESAS TECHNOLOGY

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