TSI721A1-16GCLY Renesas

TSI721A1-16GCLY electronic component of Renesas Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of TSI721A1-16GCLY PCI Interface IC across the USA, India, Europe, Australia, and various other global locations. TSI721A1-16GCLY PCI Interface IC are a product manufactured by Renesas. We provide cost-effective solutions for PCI Interface IC, ensuring timely deliveries around the world.

Part No. TSI721A1-16GCLY
Manufacturer: Renesas
Category: PCI Interface IC
Description: PCI Interface IC Protocol Converter Bridge
Datasheet: TSI721A1-16GCLY Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 10
QtyUnit Price
1$ 35.2646
N/A

Obsolete

Availability 0
MOQ : 10
Multiples : 1
QtyUnit Price
10$ 189.4259
30$ 189.4259
N/A

Obsolete
   
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We are delighted to provide the TSI721A1-16GCLY from our PCI Interface IC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TSI721A1-16GCLY and other electronic components in the PCI Interface IC category and beyond.

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Titl Tsi721 Datasheet April 4, 2016Co Table of Contents About this Document......................................................................................................................6 Overview.................................................................................................................................................................................................... 6 Document Conventions.............................................................................................................................................................................. 6 Revision History......................................................................................................................................................................................... 7 1. Device Overview............................................................................................................................ 8 1.1 Overview.................................................................................................................................................................................................... 8 1.2 Features..................................................................................................................................................................................................... 8 1.2.1 PCIe Features............................................................................................................................................................................ 8 1.2.2 S-RIO Features.......................................................................................................................................................................... 9 1.2.3 Bridging Features....................................................................................................................................................................... 9 1.2.4 Messaging Features................................................................................................................................................................. 10 1.2.5 Block DMA Engine Features .................................................................................................................................................... 10 1.2.6 Miscellaneous Features.............................................................................................................................................................11 1.3 Block Diagram.......................................................................................................................................................................................... 12 1.3.1 PCIe Interface........................................................................................................................................................................... 12 1.3.2 S-RIO Interface......................................................................................................................................................................... 12 1.3.3 Messaging Engine.................................................................................................................................................................... 12 1.3.4 Mapping Engine........................................................................................................................................................................ 12 1.3.5 Block DMA Engine.................................................................................................................................................................... 12 1.4 Typical Applications................................................................................................................................................................................. 13 1.4.1 Defense/Aerospace Application............................................................................................................................................... 13 1.4.2 Video and Imaging Application ................................................................................................................................................. 15 1.4.3 Wireless Application................................................................................................................................................................. 15 2. Signals ......................................................................................................................................... 17 2.1 Overview.................................................................................................................................................................................................. 17 2.2 Ballmap.................................................................................................................................................................................................... 18 2.3 Pinlist....................................................................................................................................................................................................... 19 2.4 PCIe Signals............................................................................................................................................................................................ 19 2.5 S-RIO Signals.......................................................................................................................................................................................... 20 2.6 General Signals....................................................................................................................................................................................... 20 2.7 I2C Signals.............................................................................................................................................................................................. 21 2.8 JTAG and Test Interface Signals.............................................................................................................................................................. 21 2.9 GPIO Signals........................................................................................................................................................................................... 22 2.10 Power-up Signals..................................................................................................................................................................................... 23 2.11 Power Supply Signals.............................................................................................................................................................................. 26 3. Electrical Characteristics........................................................................................................... 27 3.1 Absolute Maximum Ratings ..................................................................................................................................................................... 27 3.2 Recommended Operating Conditions...................................................................................................................................................... 28 3.3 Power Consumption................................................................................................................................................................................. 28 Tsi721 Datasheet 2 April 4, 2016 Integrated Device Technology

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
ID4
IDT
IDT, Integrated Device Technology Inc
INTEGRATED DEVICE
INTEGRATED DEVICE TECHNOLOGY
INTEGRATED DEVICES TECH AID
Intersil
INTERSIL - FGC
Intersil(Renes as Electronics)
Intersil(Renesas Electronics)
ITS
REA
RENESAS
RENESAS (IDT)
RENESAS (INTERSIL)
Renesas / IDT
Renesas / Intersil
Renesas Electronics
Renesas Electronics America
RENESAS TECHNOLOGY
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