ZSSC3218 High-End 18-Bit Sensor Signal Conditioner Datasheet Brief Description Benefits Integrated 26-bit calibration math digital signal The ZSSC3218 is a sensor signal conditioner (SSC) processor (DSP) integrated circuit for high-accuracy amplification and Fully corrected signal at digital output analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high- Layout customized for die-die bonding with resolution sensor module applications, the sensor for high-density chip-on-board assembly st nd ZSSC3218 can perform offset, span, and 1 and 2 One-pass calibration minimizes calibration costs order temperature compensation of the measured No external trimming, filter, or buffering com- signal. Developed for correction of resistive bridge or ponents required absolute voltage sensors, it can also provide a Highly integrated CMOS design corrected temperature output measured with an Integrated reprogrammable non-volatile memory internal sensor. Excellent for low-voltage and low-power battery The measured and corrected sensor values are applications provided at the digital output pins, which can be 2 Optimized for operation in calibrated resistive configured as I C* ( 3.4MHz) or SPI ( 20MHz). (e.g., pressure) sensor or calibrated absolute Digital compensation of signal offset, sensitivity, voltage (e.g., thermopile) sensor modules temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running Physical Characteristics a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, Supply voltage range: 1.68V to 3.6V multiple-time programmable (MTP) memory. Pro- Current consumption: 1.0mA (operating mode) gramming the ZSSC3218 is simple via the serial Sleep State current: 20nA (typical) interface. The interface is used for the PC-controlled Temperature resolution: <0.003K/LSB calibration procedure, which programs the set of Best-in-class energy-efficiency: calibration coefficients in memory. The ZSSC3218 with 16-bit resolution: <140pJ/step provides accelerated signal processing, increased with 18-bit resolution: <50pJ/step resolution, and improved noise immunity in order to support high-speed control, safety, and real-time Operation temperature: 40C to +85C sensing applications with the highest requirements Small die size for energy efficiency. Delivery options: die for wafer bonding 2 * I C is a trademark of NXP. Features ** FSO = Full Scale Output. Flexible, programmable analog front-end design up to 18-bit analog-to-digital converter (ADC) ZSSC3218 Application Example Fully programmable gain amplifier for optimizing VSS sensor signals: gain range 6.6 to 216 (linear) VDD VDD Internal auto-compensated temperature sensor Stacked-Die Sensor Module Digital compensation of individual sensor offset VDD ZSSC3218 SS st nd VSS 1 and 2 order digital compensation of sensor VSS st nd VDDB INP(+) SS MOSI gain as well as 1 and 2 order temperature gain SDA RES RES and offset drift sensor element INP SCLK VDDB SCL Microcontroller VSSB Programmable interrupt operation INN EOC EOC MOSI INN(-) VSSB High-speed sensing: e.g. 16-bit conditioned SDA MISO MISO -1 SCLK SCL sensor signal measurement rate >500s Typical sensor elements can achieve an accu- racy of better than 0.10% FSO** at -40 to 85C 2016 Integrated Device Technology, Inc. 1 April 20, 2016 Battery Signal Output / Post-processingZSSC3218 High-End 18-Bit Sensor Signal Conditioner Datasheet Vreg int VDDB ZSSC3218 V VTP DD Temperature Voltage Block Diagram AGND / CM Bias Current Reference Generator Generator Regulator V Sensor TN Power Ctr. V SS ZSSC3218 DSP Core A EOC (Calculations, INP D Sensor Pre- Communication) 18 Bit Amplifier INN Bridge VSSB SCLK/SCL SS SPI MOSI/SDA System MISO Clock TM MTP Power-ON Control IC Generator RES Reset Unit Oscillator Applications Barometric altitude measurement for portable navigation or emergency call systems Altitude measurement for car navigation Weather forecast Fan control Industrial, pneumatic, and liquid pressure High-resolution temperature measurements Object-temperature radiation (via thermopile) Sales Code Description Package ZSSC3218BI1B Dietemperature range: 40C to +85 C thickness 304m Unsawn wafer ZSSC3218BI2B Dietemperature range: 40C to +85 C thickness 725m Unsawn wafer (w/o backlapping) ZSSC3218BI3R ES PQFN24temperature range: 40C to +85 C engineering Packaged die samples 2016 Integrated Device Technology, Inc. 2 April 20, 2016 Multiplexer