THS106J ROCPU Technology

THS106J electronic component of ROCPU Technology Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of THS106J DIP Switches/SIP Switches across the USA, India, Europe, Australia, and various other global locations. THS106J DIP Switches/SIP Switches are a product manufactured by ROCPU Technology. We provide cost-effective solutions for DIP Switches/SIP Switches, ensuring timely deliveries around the world.

Part No. THS106J
Manufacturer: ROCPU Technology
Category: DIP Switches/SIP Switches
Description: 6Bit SPST 24V Black 25mA 3千次 Slide (Standard),凹槽式 SMD-12P,5.4x9.2mm DIP Switches ROHS
Datasheet: THS106J Datasheet (PDF)
Price (USD)
1: USD 1.575 ea
Line Total: USD 1.58 
Availability : 1379
  
Ship by Fri. 29 Aug to Wed. 03 Sep
QtyUnit Price
1$ 1.575
10$ 1.2722
30$ 0.8406
100$ 0.6561
500$ 0.5354
1000$ 0.5038

Availability 1379
Ship by Fri. 29 Aug to Wed. 03 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.575
10$ 1.2722
30$ 0.8406
100$ 0.6561
500$ 0.5354
1000$ 0.5038

   
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We are delighted to provide the THS106J from our DIP Switches/SIP Switches category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the THS106J and other electronic components in the DIP Switches/SIP Switches category and beyond.

Tariff Desc

8536.50.99 SWITCHES, PRINTED CIRCUIT BOARD, multi-actuator, dual in-line package (DIP) OR surface-mount package (SMP)
Op. 11.05.1998 Dec. 17.07.1998 - TC 9803964
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