Product Information

BD7185AGWL-E2

BD7185AGWL-E2 electronic component of ROHM

Datasheet
Power Management Specialized - PMIC DDR2DDR3 SPD EEPROM

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.4213 ea
Line Total: USD 10.42

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 2500
Multiples : 2500
2500 : USD 4.6851

     
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Datasheet Power Management LSI for Mobile Phone BD7185AGWL General Description Key Specifications The BD7185AGWL is an integrated Power Management Input Voltage Range: 2.6V to 5.5V LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- Output Voltage Range: 1.0V to 3.4V 3.8mm Wafer-level CSP package, which is designed to Switching Frequency: 2.0MHz(Typ) meet demands for space-constrained Smart phones. OFF Current: 0.3A (Typ) Operating Temperature Range: -35 to +85 The device provides 5-Buck Converters. The device also includes 12 general-purpose LDOs Package W(Typ) x D(Typ) x H(Max) providing a wide range of voltage and current UCSP50L3C 3.80mm x 3.80mm x 0.57mm capabilities. All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms. Features 5-channel high-efficiency Buck Converters 2 (16-step adjustable V by I C) O 12-channel CMOS-type LDO 2 (16-step adjustable V by I C) O LDO and Buck Converter power ON/OFF control by 2 I C interface or external pin. Power ON/OFF sequence. 32.768kHz OSC and output buffer. 4-to-1 analog switch. TCXO buffer. SIM card I/F 2 I C compatible Interface. 2 I C device address changeable by ADRS pin. (Device address is 1001011,1001100) Small and thin CSP package (3.8mm X 3.8mm height 0.57mm max) Applications Smart Phones Tablets Mobile Router Data Transmitter Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays . www.rohm.com TSZ02201-0Q4Q0AB00010-1-2 1/75 2013 ROHM Co., Ltd. All rights reserved. 8.Apr.2014 Rev.001DatasheetDatasheet BD7185AGWL Absolute Maximum RatingsTa=25C Parameter Symbol Rating Unit Maximum Supply Voltage 1 VBATMAX 7.0 V (VBATREF,VBAT, VIN1) Maximum Supply Voltage 2 VPBATMAX 7.0 V (PBAT1,2,3,4,5) Maximum Supply Voltage 3 VIN2MAX 4.2 V (VIN2 ) Maximum Input Voltage 1 (OUT1, OUT2, OUT3, OUT4, OUT5, OUT6, OUT7, OUT8, OUT9, OUT10, LX1, LX2, LX3, LX4, LX5, VINMAX1 7.0 V PSET, ADRS, EN O7, PWRON, PWRHOLD, POR, TCXO IN, (Note 1) OSC IN, DVDD OSC OUT, SIMRSTIN, SIMCLKIN, SIMIODBB, SIMIO) Maximum Input Voltage 2 VINMAX2 DVDD + 0.3 V (SDA, SCL) Maximum Input Voltage 3 VINMAX3 VIN2MAX+ 0.3 V (OUT11,12, REFC) (Note 2) Power Dissipation Pd 1.38 W Operating Temperature Range Topr -35 +85 C Storage Temperature Range Tstg -55 +125 C (Note 1) The DVDD Voltage must be under the Battery voltage VBAT, PBAT anytimes. (Note 2) This is an allowable loss of the ROHM evaluation board (54mm62mm)When a substrate is implemented, the allowable loss varies from the size and material of the substrate. Derate 1% per C for temperatures higher than 25C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25C) Parameter Symbol Range Unit (Note3) VBAT Voltage VBAT 2.70 5.50 V (Note3) PBAT Voltage VPBAT 2.70 5.50 V (Note4) VIN1 Voltage VIN1 2.70 5.50 V (Note5) VIN2 Voltage VIN2 1.40 1.80 V (Note 3) Whenever VBAT, PBAT, VIN1, or VIN2 falls below the LDO or SWREG output voltage, or below certain levels, LDO and SWREG output is not guaranteed to meet the published specifications. It is necessary to supply the same voltage to VBAT and PBAT. (Note 4) It is recommended to connect SWREG5 output to VIN1 to maximize efficiency. (Note 5) It is recommended to connect SWREG4 output to VIN2 to maximize efficiency. Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays . www.rohm.com TSZ02201-0Q4Q0AB00010-1-2 2/75 2014 ROHM Co., Ltd. All rights reserved. 8.Apr.2014 Rev.001

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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