Product Information

BD80C0AFPS-CE2

BD80C0AFPS-CE2 electronic component of ROHM

Datasheet
Linear Voltage Regulator IC Positive Fixed 1 Output 1A TO252S-3

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.6325 ea
Line Total: USD 2.63

1849 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1861 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 2.195
10 : USD 1.7916
100 : USD 1.6492
250 : USD 1.5424
500 : USD 1.4001
1000 : USD 1.2102
2000 : USD 1.1379
4000 : USD 1.1379
10000 : USD 1.1034

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Output Voltage
Output Current
Number of Outputs
Polarity
Input Voltage MIN
Input Voltage MAX
Output Type
Minimum Operating Temperature
Maximum Operating Temperature
Dropout Voltage
Qualification
Packaging
Brand
Dropout Voltage - Max
Voltage Regulation Accuracy
Line Regulation
Load Regulation
Operating Supply Current
Product Type
Factory Pack Quantity :
Subcategory
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Datasheet For Automotive 1A, 8.0V Output LDO Regulator BD80C0AFPS-C General Description Key Specifications The BD80C0AFPS-C is a low-saturation regulator which is Temperature Range (Ta): -40C to +125C 8.0V output voltage and 1A output current capability. Operating Input Range: 9.0V to 26.5V Electrolytic, tantalum and ceramic capacitors can be used Circuit Current: 0.6mA (Typ) as output capacitor to prevent oscillation. The IC has a Output Current Capability: 1A built-in over current protection circuit that prevents the High Output Voltage Accuracy: 1%(Ta = +25 C) destruction of the IC due to output short circuits and a 3%(-40 C Ta +125 C) thermal shutdown circuit that protects the IC from thermal damage due to overloading. Package W(Typ) x D(Typ) x H(Max) Features TO252S-3 6.50mm x 9.50mm x 1.30mm (Note 1) AEC-Q100 Qualified Over Current Protection (OCP) Thermal Shutdown Protection (TSD) (Note 1) Grade 1 Applications Power Train Body Audio System Navigation System Typical Application Circuit VCC and VO pin capacitors: 1 F C (Min), 1 F C (Min) IN O Please refer to theApplication and Implementio. VCC VO Co C V IN CC GND Typical Application Circuit Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0G1G1A600030-1-2 2017 ROHM Co., Ltd. All rights reserved. 1/23 22.Dec.2017 Rev.001 TSZ22111 14 001 BD80C0AFPS-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configurations .......................................................................................................................................................................... 3 Pin Descriptions .............................................................................................................................................................................. 3 Block Diagram ................................................................................................................................................................................ 3 Description of Blocks ...................................................................................................................................................................... 4 Absolute Maximum Ratings ............................................................................................................................................................ 5 Thermal Resistance ........................................................................................................................................................................ 5 Operating Conditions ...................................................................................................................................................................... 6 Electrical Characteristics................................................................................................................................................................. 6 Typical Performance Curves ........................................................................................................................................................... 7 Figure 1. Circuit Current vs Supply Voltage................................................................................................................................. 7 Figure 2. Output Voltage vs Supply voltage ................................................................................................................................ 7 Figure 3. Output Voltage vs Supply voltage ................................................................................................................................ 7 Figure 4. Output Voltage vs Output Current (OCP characteristic) ............................................................................................... 7 Figure 5. Dropout Voltage ........................................................................................................................................................... 8 Figure 6. Ripple Rejection ........................................................................................................................................................... 8 Figure 7. Output Voltage vs Junction Temperature ..................................................................................................................... 8 Figure 8. Circuit Current vs Output Current ................................................................................................................................. 8 Figure 9. Output Voltage vs Junction Temperature (Thermal Shutdown Circuit Characteristic) .................................................. 9 Measurement Circuit for Typical Performance Curves ................................................................................................................. 10 Application and Implementation .................................................................................................................................................... 11 Selection of External Components ............................................................................................................................................ 11 Input Pin Capacitor ................................................................................................................................................................ 11 Output pin capacitor............................................................................................................................................................... 12 Linear Regulators Surge Voltage Protection ............................................................................................................................. 13 Positive surge to the input ..................................................................................................................................................... 13 Negative surge to the input .................................................................................................................................................... 13 Linear Regulators Reverse Voltage Protection .......................................................................................................................... 13 Protection against Input Reverse Voltage ................................................................................................................................. 14 Protection against Reverse Output Voltage when Output Connect to an Inductor .................................................................... 15 Power Dissipation ......................................................................................................................................................................... 16 TO252S-3 .................................................................................................................................................................................. 16 Thermal Design ............................................................................................................................................................................ 17 Calculation Example (TO252S-3) .............................................................................................................................................. 17 I/O Equivalence Circuit ................................................................................................................................................................. 18 Operational Notes ......................................................................................................................................................................... 19 1. Reverse Connection of Power Supply ................................................................................................................................... 19 2. Power Supply Lines............................................................................................................................................................... 19 3. Ground Voltage ..................................................................................................................................................................... 19 4. Ground Wiring Pattern........................................................................................................................................................... 19 5. Operating Conditions............................................................................................................................................................. 19 6. Inrush Current ....................................................................................................................................................................... 19 7. Thermal Consideration .......................................................................................................................................................... 19 8. Testing on Application Boards ............................................................................................................................................... 19 9. Inter-pin Short and Mounting Errors ...................................................................................................................................... 19 10. Unused Input Pins ............................................................................................................................................................... 19 11. Regarding the Input Pin of the IC ........................................................................................................................................ 20 12. Ceramic Capacitor............................................................................................................................................................... 20 13. Thermal Shutdown Protection Circuit(TSD) ........................................................................................................................ 20 14. Over Current Protection Circuit (OCP) ................................................................................................................................ 20 Physical Dimension and Packing Information ............................................................................................................................... 21 Ordering Information ..................................................................................................................................................................... 22 Marking Diagram .......................................................................................................................................................................... 22 Revision History ............................................................................................................................................................................ 23 www.rohm.com TSZ02201-0G1G1A600030-1-2 2017 ROHM Co., Ltd. All rights reserved. 2/23 TSZ22111 15 001 22.Dec.2017 Rev.001

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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