Datasheet USB Audio Decoder LSI Series AAC/WMA/MP3 +SD Memory Card + iPod BU94502Cxxx Series Description Package W(Typ) x D(Typ) x H(Max) BU94502Cxxx series are WAV/AAC/WMA/MP3 decoder LSI which contains USB host, SD card I/F, audio DAC, system controller, regulator for internal CORE power supply. Features USB2.0 Full Speed host I/F function contained. SD card I/F function contained. 2 I C format I/F function contained. 2 Protocol conversion from I C to USB HID or from USB 2 HID to I C. MP3 decode function contained. (Available for MPEG1, 2 and 2.5, Layer 1, 2 and 3) WMA decode function contained. VQFN040V6060 (Available for WMA9 standard and not available for DRM) 6.00mm x 6.00mm x 1.00mm AAC decode function contained. (Available for MPEG4 AAC-LC and not available for DRM) WAV format file playing function contained. Sample Rate Converter contained. System Controller contained. FAT analysis function contained. Folder pass table making function contained. ID3TAG and WMATAG and AACTAG Analysis. Fast forward playing and fast backward playing function contained. Resume function contained. Reading a specified file data is possible from connected memory. LUN is selectable. Sound Effect function contained. SQFP-T52 Digital Audio Out function contained. 12.00mm x 12.00mm x 1.50mm 2 (I S, EIAJ, S/PDIF) Audio DAC contained. Regulator for internal CORE power supply contained. Applications Audio products, etc Line up Part number Package Ordering part number BU94502CMUV VQFN040V6060 Reel of 2000 BU94502CMUV-E2 BU94502CKS2 SQFP-T52 Tray of 1000 BU94502CKS2 Product structureSilicon Monolithic integrated circuit Radiation resistance design is not arranged w ww.rohm.com TSZ02201-0V1V0E600170-1-2 2016 ROHM Co., Ltd. All rights reserved. 1/66 TSZ2211114001 2016.01.05 Rev.001 BU94502Cxxx series Basic circuit application diagram -part1 This LSI builds in regulator for internal CORE power supply (1.5V). DVDD M terminal of 10PIN connect to bypass condenser and dont connect to power supply (3.3V) Please confirm the optimal oscillation circuit parameters applicable to your systems or products with th e oscillator manufacturer in advance. VQFN040V6060 package exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. Figure 1. an example of connection circuit application(BU94502CMUV) www.rohm.com TSZ02201-0V1V0E600170-1-2 2016 ROHM Co., Ltd. All rights reserved. 2/66 TSZ2211115001 2016.01.05 Rev.001