The Samsung RC1608F1001CS is a water-soluble solder flux designed for SMT and BGA applications. This flux offers enhanced reliability and improved electrical and thermal performance. It is formulated with low-solids and low-corrosion properties and is designed for use with lead (Pb) and lead-free solders. The RC1608F1001CS is ideal for use on aluminum, copper, nickel, titanium, and gold substrates.