F-215 SUPPLEMENT
HDAF1108.0S132
HDAM1112.0S132
(2,00 mm) .0787" HDAM, HDAF SERIES
RUGGED ELEVATED HIGH DENSITY ARRAY
HDAM Mates with:
NO. OF PINS LEAD PLATING NO. OF SOLDER OTHER
HDAF
HDAM
PER ROW STYLE OPTION ROWS TYPE OPTION
HDAF Mates with:
HDAM
SPECIFICATIONS
S
P
= 30"
= Pick &
Specify
For complete speci cations and 2
11, 15, 23
(0,76 m) 13
Place Pad
recommended PCB layouts see
= Lead-Free
LEAD
Gold on
www.samtec.com?HDAM or
Tin Alloy
STYLE
contact area,
www.samtec.com?HDAF
95.5% Sn/
Matte Tin
from
Insulator Material: 3.8% Ag/0.7%
on tails and
Black LCP chart
Cu
guide pins
Contact Material:
Solder Charge
Copper Alloy
Plating:
(22,50) .886
A
Au or Sn over
50" (1,27 m) Ni
LEAD
A
Current Rating:
STYLE
3.4 A per pin
(14,41)
(6 adjacent pins powered) 12.0
.567
Operating Temp Range:
1A 1M
(19,41)
-55C to +125C No. of No. of
17.0 Integrated guide
.764
Pins Pins
Contact Resistance: 19 m
posts
Per Per
Working Voltage: 200 VAC
Row Row
(2,00)
Mated Cycles: 100
x x
.0787 HDAM/HDAF
RoHS Compliant: Yes
(2,00) (2,00) Rated @ 3dB Insertion Loss*
35 mm Stack Height
Lead-Free Solderable: Yes .0787 .0787
+ +
Single-Ended
9 GHz / 18 Gbps
(16,06) (11,55)
Signaling
RECOGNITIONS .632 .455
Differential Pair
9 GHz / 18 Gbps
Signaling
For complete scope of
recognitions see *Data based on simulations using Final Inch design.
(1,20)
www.samtec.com/quality
*Performance data includes effects of a
.0472
(5,09) .200 non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
www.samtec.com?HDAF or contact sig@samtec.com
DIFFERENTIAL
APPLICATIONS
NO. OF PINS LEAD PLATING NO. OF SOLDER OTHER
(1,20)
HDAF
PER ROW STYLE OPTION ROWS TYPE OPTION
.0472
(2,00)
.0787
S P
= 30" = Pick &
Specify
2
11, 15, 23
13
(0,76 m) Place Pad
= Lead-Free
LEAD
PAIR
Gold on
ARRAY Tin Alloy
STYLE
COUNT*
contact area,
95.5% Sn/
(22,50) .886
44 from
11x13 Matte Tin
3.8% Ag/
on tails and
15x13 60 chart
0.7% Cu
weld tabs
23x13 92 Solder Charge
*2:1 S:G Ratio
No.
of
Pins No.
ALSO AVAILABLE
Per of
(MOQ Required) Row Pins
x Per
(2,00) Row
Tin-Lead Solder Charge
.0787 x
+ (2,00)
Other platings
LEAD
(11,55) .0787
A
STYLE
Contact Samtec. .455 +
(17,92)
(10,51)
1M
1A
08.0 .706
.414
Integrated guide
(20,51)
18.0 posts
.807
Note: HD Mezz is a trademark
of Molex Incorporated
(1,20)
(2,00)
.0472
Note: Some lengths, styles
.0787
A
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, speci cations and components are subject to change without notice.X-ON Electronics
Largest Supplier of Electrical and Electronic Components
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