F-215
QTH09001CDA
QTH03001LDA
QTH06007FDA
(0,50 mm) .0197" QTH SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane for
Standard Stack Heights
power or ground
Board Mates:
from 5 mm to 25 mm
SPECIFICATIONS
QSH
For complete speci cations and
Cable Mates:
recommended PCB layouts see
HQCD, HQDP
www.samtec.com?QTH
(See Also Available note)
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50" (1,27 m) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
Rated @ 3dB Insertion Loss
25 A per ground plane QTH/QSH
Type
(1 ground plane powered) 5 mm Stack Height
with PCB effects* w/o PCB effects**
Operating Temp Range:
Single-Ended Signaling D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
-55C to +125C
Voltage Rating:
Differential Pair Signaling D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
125 VAC (5 mm Stack Height)
Differential Pair Signaling DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
Max Cycles: 100
RoHS Compliant: Yes *Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Processing:
Performance data for other stack heights and complete test data
LeadFree Solderable: Yes
available at www.samtec.com?QTH or contact sig@samtec.com
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
LEAD
PINS PER ROW PLATING OTHER
Board Stacking:
TYPE
QTH
A
STYLE
NO. OF PAIRS OPTION OPTION
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Specify
RECOGNITIONS
K
LEAD
= (7,00 mm)
For complete scope
030, 060, 090 F D
STYLE
.275" DIA
of recognitions see
(60 total pins per bank = D) = Gold Flash on = Single-Ended
from
Polyimide
www.samtec.com/quality
Signal Pins and
chart lm Pick &
Ground Plane,
020, 040, 060 DDP
Place Pad
Matte Tin on tails
(20 pairs per bank = DDP) = Differential Pair
(N/A with -05 &
FILE NO: 090871_0_000
(01 only)
-07 lead style)
L
= 10" (0,25 m)
TR
D = (No. of Pins per Row/30) x (20,00) .7875 Gold on Signal Pins
ALSO AVAILABLE
QTH HEIGHT
= Tape & Reel
and Ground Plane,
(MOQ Required)
LEAD A WITH
DP = (No. of Pairs per Row/20) x (20,00) .7875
(090 positions
Matte Tin on tails
STYLE QSH*
(20,00) .7875 maximum)
14 mm, 15 mm, 22 mm
01
(4,27) (5,00)
01
and 30 mm stack height .168 .197
C*
L
(7,11)
(Caution: Some automatic = Electro-Polished (7,26) (8,00)
02
= Latching
.280 .286 .315
Selective
placement/inspection
Option
(10,27) (11,00)
50" (1,27 m) min Au
machines may have 03
02
.404 .433 (01 lead
(0,50)
(0,20)
over 150" (3,81 m)
component height
.0197 style only)
.008 (15,25) (16,00)
Ni on Signal Pins in
04
restrictions. Please consult .600 .630
(N/A on
contact area,
machinery speci cations.) (18,26) (19,00) 060 (DDP)
10" (0,25 m) min Au 05
.718 .748
& 090)
30" (0,76 m) Gold over 50" (1,27 m)
(24,24) (25,00)
07
Ni on Ground Plane
(Specify -H plating
01 & 02 .954 .984
in contact area,
for Data Rate cable mating
*Processing conditions
Matte Tin over 50"
applications.) will affect mated height.
03 thru 07
(1,27 m) min Ni
Edge Mount & Guide Posts
on all solder tails
80 (-DP), 120, 150
(0,76) OTHER
*Note: C Plating passes
positions per row
.030
10 year MFG testing SOLUTIONS
Retention Option
Note: Some lengths, styles
(0,64)
Board Spacing Standoffs.
Contact Samtec.
(0,89) and options are non-standard,
.025
See SO Series.
.035 non-returnable.
L
DIA
WWW.SAMTEC.COM
Due to technical progress, all designs, speci cations and components are subject to change without notice.
100 GbE
Hypertransport
XAUI
PCI Express
SATA
InfiniBand
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
A
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Largest Supplier of Electrical and Electronic Components
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