EClamp2374P ESD/EMI Protection for Color LCD Interfaces TM PROTECTION PRODUCTS - EMIClampPROTECTION PRODUCTS PRELIMINARY Features Description TM The EClamp 2374P is a low pass filter array with Bidirectional EMI/RFI filter with integrated TVS integrated TVS diodes. It is designed to suppress for ESD protection unwanted EMI/RFI signals and provide electrostatic ESD protection to IEC 61000-4-2 (ESD) Level 4, discharge (ESD) protection in portable electronic 15kV (air), 8kV (contact) equipment. This state-of-the-art device utilizes solid- Filter performance: 30dB minimum attenuation state silicon-avalanche technology for superior clamp- 1.8GHz to 2.5GHz ing performance and DC electrical characteristics. TVS working voltage: 5V protection of colorprotection of colorprotection of color They have been optimized for protection of colorprotection of color Resistor: 100 +/ 15% LCD panelsLCD panelsLCD LCD panelsLCD panelspanels in cellular phones and other portable Typical Capacitance: 20pF (VR = 0V) electronics. Protection and filtering for four lines The device consists of four identical circuits comprised Solid-state technology of TVS diodes for ESD protection, and a resistor - Mechanical Characteristics capacitor network for EMI/RFI filtering. A series resistor value of 100 and a capacitance value of 10pF SLP2116P8 8-pin package are used to achieve 30dB minimum attenuation from RoHS/WEEE Compliant 1.8GHz to 2.5GHz. The TVS diodes provide effective Nominal Dimensions: 2.1 x 1.6 x 0.58 mm suppression of ESD voltages in excess of 15kV (air Lead Pitch: 0.5mm discharge) and 8kV (contact discharge) per IEC 61000- Lead finish: NiPd 4-2, level 4. Marking : Marking Code Packaging : Tape and Reel per EIA 481 The EClamp2374P is in a 8-pin, RoHS compliant, SLP2116P8 package. It measures 2.1 x 1.6 x Applications 0.58mm. The leads are spaced at a pitch of 0.5mm Color LCD Protection and are finished with lead-free NiPd. The small pack- Cell Phone CCD Camera Lines age makes it ideal for use in portable electronics such Clamshell Cell Phones as cell phones, digital still cameras, and PDAs. Circuit Diagram (Each Line) Package Configuration 2.10 1 2 100 IN OUT 1.60 10pF 10pF 0.50 BSC GND 0.58 Device Schematic (4X) 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 12/6/2005 1EClamp2374P PROTECTION PRODUCTS PRELIMINARY Maximum Ratings Rlating Seymbo Vsalu Unit ESD per IEC 61000-4-2 (Air) +/- 17 V kV ESD ESD per IEC 61000-4-2 (Contact) +/- 12 o JTunction Temperature 125 C J o OTperating Temperature -40 to +85 C op o STtorage Temperature -55 to +150 C STG o Electrical Characteristics (T = 25 C) PrPPPrPlaaaaarrrrraaaaammmmmeeeeettttteeeeerrr SSSlSlSsyyyyymmmmmbbbbboooooll CsCCCmCsooooonnnnndddddiiiiitttttiiiiiooooonnnnnss MmMMMlMmiiiiinnnnniiiiimmmmmuuuuumm TlTTTmTlyyyyypppppiiiiicccccaaaaall MmMMMsMmaaaaaxxxxxiiiiimmmmmuuuuumm UsUUUUsnnnnniiiiitttttss TVVS Reverse Stand-Off Voltage 5V RWM TVVS Reverse Breakdown Voltage I=61mA 8 1V0 BR t TIVS Reverse Leakage Current V=53.0V 0A. R RWM TRotal Series Resistance E5ach Line 80150 1s1 Ohm TCotal Capacitance Input to Gnd, 106 242Fp in Each Line V = 0V, f = 1MHz R TCotal Capacitance Input to Gnd, 91131Fp in Each Line V = 2.5V, f = 1MHz R www.semtech.com 2005 Semtech Corp. 2