EClamp8052P EMIClamp 2-Line Common Mode Filter and Low Capacitance ESD Protection PROTECTION PRODUCTS Description Features Transient Protection to EClamp8052P integrates common mode filtering IEC 61000-4-2 (ESD) 30kV (Air), 25kV (Contact) with low capacitance ESD protection and is designed IEC 61000-4-4 (EFT) 4kV (5/50ns) specifically for MIPI, MHL, and USB interfaces. Each IEC 61000-4-5 (Lightning) 6A (8/20s) device provides filtering and ESD protection for one Package design optimized for high speed lines high-speed differential pair. ESD protection and common mode filtering for two high-speed lines High differential bandwidth cutoff frequency EClamp8052P is an easily implemented solution for Low ESD Clamping Voltage replacing discrete common mode chokes and ESD Dynamic Resistance: 0.50 Ohms (Typ) protection devices in a single package. These devices Solid-State Silicon-Avalanche Technology utilize silicon avalanche technology for superior ESD and TLP clamping performance. They feature high Mechanical Characteristics maximum ESD withstand voltage of +/- 25kV contact, SGP1917N5 package +/-30kV air discharge per IEC 61000-4-2. The integrated Pb-Free, Halogen Free, RoHS/WEEE Compliant common-mode choke has a typical differential mode Nominal Dimensions: 1.9 x 1.70 x 0.55 mm cutoff frequency >3GHZ and typical common mode Molding Compound Flammability Rating: UL 94V-0 suppression of 10dB at 500MHz and 15dB from 1GHz Marking : Marking Code + Date Code Packaging : Tape and Reel to 2.8GHz. Each channel series resistance is 1.8 Ohms maximum. Applications Industrial Equipment EClamp8052P is in a 7-pin SGP1917N5 package, USB 2.0 / USB 3.0 measuring 1.9 x 1.7mm with a nominal height of HDMI / MHL 0.55mm. The leads have a nominal pin-to-pin pitch of MIPI Camera Serial Interface (CSI) 0.50mm. Flow- through package design simplifies PCB MIPI Display Serial Interface (DSI) layout and maintains signal integrity on high-speed lines. Circuit Diagram Pin Configuration I/O+ In I/O+ Out I/O+ In I/O+ Out 1 I/O- Out I/O- In I/O- In I/O- Out GND GND EClamp8052P Page 1 www.semtech.com Final Datasheet Rev 4.1 Semtech Oct 4, 2016 External Side Towards Connector Internal Side Towards ICAbsolute Maximum Ratings Rating Symbol Value Units Peak Pulse Current (tp = 8/20s) I 6 A PP (1) ESD per IEC 61000-4-2 (Contact) 25 V kV ESD (1) ESD per IEC 61000-4-2 (Air) 30 O Operating Temperature T -40 to +125 C J O Storage Temperature T -55 to +150 C STG O Electrical Characteristics (T=25 C unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units O O -40 C to 125 C Reverse Stand-Off Voltage V 5 V RWM Pin 1 or Pin 2 to Pin 3 I = 1mA, t O O Reverse Breakdown Voltage V -40 C to 125 C 6.5 9 11 V BR Pin 1 or 2 to Pin 3 O Reverse Leakage Current I V = 5V T = 25 C 0.005 0.100 A R RWM I = 1A, tp = 8/20s, PP Clamping Voltage V 12 V C Pin 1 or 2 to Pin 3 I = 6A, tp = 8/20s, PP Clamping Voltage V 17 V C Pin 1 or 2 to Pin 3 I = 4A, tp = 0.2/100ns (TLP) (2) PP ESD Clamping Voltage V 11 V C Pin 1 or 2 to Pin 3 I = 16A, tp = 0.2/100ns (TLP) (2) PP ESD Clamping Voltage V 17 V C Pin 1 or 2 to Pin 3 tp = 0.2/100ns (TLP) (2), (3) Dynamic Resistance R 0.50 Ohms DYN Pin 1 or 2 to Pin 3 V = 0V, f = 1MHz R O Total Channel Capacitance C T = 25 C 0.95 1.2 pF IN Pin 1 or 2 to Pin 3 Differential (SDD21) Cut-Off f 50 Ohm Source and Load Termination 3 GHz 3dB Frequency f = 75MHz 3 dB Common Mode (SCC21) f f = 500MHz 10 dB ATT Attenuation f = 1GHZ - 2.5GHz 20 dB Channel Resistance R Input to Output 1.3 1.8 Ohms CH Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I and V averaging window: t = 70ns to t = 90ns. TLP TLP 1 2 (3): Dynamic resistance calculated from I = 4A to I = 16A TLP TLP EClamp8052P Page 2 www.semtech.com Final Datasheet Rev 4.1 Semtech Oct 4, 2016