RClamp7524T Low Capacitance RClamp 4-Line ESD Protection PROTECTION PRODUCTS Description Features ESD protection for high-speed data lines to RailClamp TVS arrays are ultra low capacitance ESD IEC 61000-4-2 (ESD) 30kV (air), 25kV (contact) protection devices designed to protect high speed data IEC 61000-4-5 (Lightning) 5A (8/20s) interfaces. This series has been specifically engineered IEC 61000-4-4 (EFT) 40A (5/50ns) to protect sensitive components which are connected Package design optimized for high speed lines to high-speed data and transmission lines from Flow-Through design Protects four high-speed lines overvoltage caused by ESD (electrostatic discharge), CDE Low capacitance: 0.60pF Maximum (I/O to Ground) (Cable Discharge Events), and EFT (electrical fast Low ESD clamping voltage transients). Low dynamic resistance: 0.50 Ohms (Typ) Solid-state silicon-avalanche technology The RClamp7524T will protect four lines or two differential pairs. Each line has a maximum capacitance Mechanical Characteristics of only 0.60pF between any I/O pin and ground. This allows it to be used on circuits operating in excess SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm) of 5GHz without signal attenuation. They feature high Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead Pitch: 0.45mm maximum ESD withstand voltage of +/- 25kV contact, Lead finish: NiPdAu +/-30kV air discharge per IEC 61000-4-2. Marking: Marking Code Packaging: Tape and Reel The RClamp7524T is in a 5-pin SLP1308N5T package. It measures 1.3 x 0.8mm with a nominal height of Applications 0.40mm. The innovative flow through package design simplifies PCB layout and allows matched trace lengths HDMI 1.3 and HDMI 1.4 for consistant impedance between high speed V-By-One differential lines. The combination of small size, low USB 3.0 capacitance, and high level of ESD protection makes this MHL eDP device a flexible solution for applications such as HDMI, LVDS Interfaces MHL, MDDI, and eDP interfaces. eSATA Interfaces Package Dimension Schematic & Pin Configuration 1.30 0.45 BSC 1 2 0.80 1 3 4 5 0.50 BSC 0.40 2 RClamp7524T 1 of 9 www.semtech.com Final Datasheet Rev 5 Semtech Revision date 10/24/2016Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20s) P 75 W PK Peak Pulse Current (tp = 8/20s) I 5 A PP (1) ESD per IEC 61000-4-2 (Air) 30 V kV (1) ESD ESD per IEC 61000-4-2 (Contact) 25 O Operating Temperature T -55 to +125 C J O Storage Temperature T -55 to +150 C STG O Electrical Characteristics (T=25 C unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage V Any I/O to GND 5 V RWM Reverse Breakdown Voltage V I = 1mA, Any I/O to GND 6.5 9 11 V BR BR Reverse Leakage Current I V = 5V, Any I/O to GND 5 100 nA R RWM I = 1A 12 tp = 8/20s PP Clamping Voltage V V C Any I/O to GND I = 5A 15 PP I = 4A 11 TLP tp = 0.2/100ns 2 ESD Clamping Voltage V V C Any I/O to GND I = 16A 17 TLP 2,3 Dynamic Resistance R tp = 0.2/100ns 0.5 DYN Any I/O to GND 0.5 0.6 Junction Capacitance C V = 0V, f = 1MHz pF J R Between I/O pins 0.25 0.4 Notes 1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I and V averaging window: t1 = 70ns to t2 = 90ns. TLP TLP 3) Dynamic resistance calculated from I = 4A to I = 16A TLP TLP RClamp7524T 2 of 9 www.semtech.com Final Datasheet Rev 5 Semtech Revision Date 10/24/2016