SMF3.3 3.3 Volt TVS Array For ESD and Latch-Up Protection PROTECTION PRODUCTSPROTECTION PRODUCTS Features Description The SMF series of TVS arrays are designed to protect ESD protection for data lines to sensitive electronics from damage or latch-up due to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) ESD, lightning, and other voltage-induced transient IEC 61000-4-4 (EFT) 40A (5/50ns) events. Each device will protect up to four lines operat- Small package for use in portable electronics ing at 3.3 volts. Protects four I/O lines Working voltage: 3.3V The SMF3.3 is a solid-state devices designed specifi- Low leakage current cally for transient suppression. It is constructed using Low operating and clamping voltages Semtechs proprietary EPD process technology. The Solid-state EPD TVS technology EPD process provides low standoff voltages with significant reductions in leakage currents and capaci- Mechanical Characteristics tance over traditional pn junction processes. They offer EIAJ SC70-5L package desirable characteristics for board level protection Molding compound flammability rating: UL 94V-0 including fast response time, low clamping voltage and no device degradation. Marking : Marking Code Packaging : Tape and Reel The SMF3.3 may be used to meet the immunity re- Applications quirements of IEC 61000-4-2, level 4 (15kV air, 8kV contact discharge). The small SC70-5L package Cellular Handsets and Accessories makes them ideal for use in portable electronics such Cordless Phones as cell phones, PDAs, and notebook computers. Personal Digital Assistants (PDAs) Notebooks and Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Circuit Diagram Schematic & PIN Configuration 13 45 1 5 2 34 2 SC70-5L (Top View) www.semtech.com Revision 01/15/08 1SMF3.3 PROTECTION PRODUCTS Absolute Maximum Rating Rlating Seymbo Vsalu Unit Peak Pulse Power (tp = 8/20sP) 4s0 Watt pk Peak Pulse Current (tp = 8/20sI) 5A PP ESD per IEC 61000-4-2 (Air) 20 V kV ESD ESD per IEC 61000-4-2 (Contact) 15 o LTead Soldering Temperature 260 (10 seconds) C L o OTperating Temperature -55 to +125 C J o STtorage Temperature -55 to +150 C STG Electrical Characteristics SMF3.3 Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off Voltage 3V.3 RWM PVunch-Through Voltage I=52A3V. PT PT SVnap-Back Voltage I=850mA2V. SB SB RIeverse Leakage Current V=53.3V 05.0 0A. R RWM CVlamping Voltage I=51A, tp = 8/20s 5V. C PP CVlamping Voltage I=05A, tp = 8/20s 8V. C PP SVteering Diode Forward Voltage I = 1A, tp = 8/20s 2V.4 F PP Ground to any I/O JCunction Capacitance Each I/O pin and 205 3Fp j Ground V = 0V, f = 1MHz R I/O to I/O 1F2 p V = 0V, f = 1MHz R www.semtech.com 2008 Semtech Corp. 2