PC123XNNSZ0F Series DIP 4pin Reinforced Insulation Type PC123XNNSZ0F Photocoupler Series Description Agency approvals/Compliance PC123XNNSZ0F Series contains an IRED optically 1. Recognized by UL1577 (Double protection isolation), coupled to a phototransistor. le No. E64380 (as model No. PC123) It is packaged in a 4-pin DIP, available in wide-lead 2. Approved by BSI, BS-EN60065, file No. 7087, BS- spacing option and SMT gullwing lead-form option. EN60950 le No. 7409, (as model No. PC123) Input-output isolation voltage(rms) is 5kV. 3. Approved by SEMKO, EN60065, EN60950, (as mod- CTR is 50% to 400% at input current of 5mA el No. PC123) 4. Approved by DEMKO, EN60065, EN60950, (as mod- el No. PC123) Features 5. Approved by NEMKO, EN60065, EN60950, (as mod- 1. 4-pin DIP package el No. PC123) 2. Double transfer mold package (Ideal for Flow Solder- 6. Approved by FIMKO, EN60065, EN60950, (as model ing) No. PC123) 3. Current transfer ratio (CTR : MIN. 50% at I =5 mA, F 7. Recognized by CSA le No. CA95323, (as model No. V =5V) CE PC123) 4. Several CTR ranks available 8. Approved by VDE, DIN EN60747-5-2( ) (as an op- 5. Reinforced insulation type (Isolation distance : MIN. tion), le No. 40008087 (as model No. PC123) 0.4mm) 9. Package resin : UL ammability grade (94V - 0) 6. Long creepage distance type (wide lead-form type ( ) DIN EN60747-5-2 : successor standard of DIN VDE0884. only : MIN. 8mm) 7. High isolation voltage between input and output (V (rms) : 5kV) iso Applications 8. Lead-free and RoHS directive compliant 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different po- tentials and impedances 4. Over voltage detection Notice The content of data sheet is subject to change without prior notice. In the absence of con rmation by device speci cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speci cation sheets before using any SHARP device. Sheet No.: D2-A09501EN 1 Date Sep. 1. 2006 SHARP CorporationPC123XNNSZ0F Series Internal Connection Diagram 1 Anode 1 4 2 Cathode 3 Emitter 2 3 4 Collector (Unit : mm) Outline Dimensions 1. Through-Hole ex. PC123XNNSZ0F 2. Through-Hole (VDE option) ex. PC123XNYSZ0F Rank mark Rank mark Factory identification mark Factory identification mark Anode mark Anode mark Date code Date code 1 4 1 4 PC123 PC123 3 2 4 2 3 SHARP mark 0.3 6.5 0.3 6.5 VDE idenfication mark 0.30 0.30 7.62 4.58 0.30 0.30 7.62 4.58 Epoxy resin Epoxy resin 0.10 0.26 0.10 0.26 0.1 0.5 0.1 0.5 : 0 to 13 : 0 to 13 Product mass : approx. 0.23g Product mass : approx. 0.23g 3. Wide Through-Hole Lead-Form 4. Wide Through-Hole Lead-Form (VDE option) ex. PC123XNNFZ0F ex. PC123XNYFZ0F Factory identification mark Factory identification mark Rank mark Rank mark Anode mark Anode mark Date code Date code 1 1 4 4 2 3 2 3 PC123 PC123 4 SHARP mark 0.3 0.3 6.5 6.5 VDE idenfication mark 0.30 0.30 0.30 0.30 7.62 4.58 7.62 4.58 Epoxy resin 0.10 Epoxy resin 0.10 0.26 0.26 0.50 0.1 0.50 0.1 10.16 0.5 10.16 0.5 Product mass : approx. 0.23g Product mass : approx. 0.23g Sheet No.: D2-A09501EN 2 0.3 0.3 1.2 1.2 MIN. 2.7 0.2 0.2 0.1 0.6 0.6 1.0 0.25 2.54 0.30 4.58 0.5 2.7 0.25 2.54 0.30 4.58 0.5 0.5 3.0 3.5 0.5 3.5 TYP. 0.5 0.3 0.3 1.2 1.2 MIN. 2.7 0.2 0.2 0.1 0.6 0.6 1.0 0.25 2.54 0.30 4.58 0.5 2.7 0.25 2.54 0.30 4.58 0.5 0.5 3.0 3.5 0.5 3.5 TYP. 0.5