Product Information

PC814

PC814 electronic component of Sharp

Datasheet
PC814 OPTO SINGLE CHANNEL AC INPUT D

Manufacturer: Sharp
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.577 ea
Line Total: USD 1.58

0 - Global Stock
Ships to you by
Wed. 24 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you by Wed. 24 Apr

MOQ : 1
Multiples : 1

Stock Image

PC814
Sharp

1 : USD 1.577
10 : USD 0.7885
50 : USD 0.7096
250 : USD 0.5914
500 : USD 0.5322

     
Manufacturer
Product Category
Rise Time
Current Transfer Ratio
Fall Time
Output Type
Package / Case
Number of Channels
If - Forward Current
Maximum Collector Current
Maximum Collector Emitter Voltage
Isolation Voltage
Maximum Collector Emitter Saturation Voltage
Vf - Forward Voltage
Vr - Reverse Voltage
Pd - Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Brand
Factory Pack Quantity :
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PC814XJ0000F Series DIP 4pin PC814XJ0000F AC Input Photocoupler Series 4-channel package type is also available. (model No. PC844XJ0000F Series) Description Agency approvals/Compliance PC814XJ0000F Series contains an IRED optically 1. Recognized by UL1577, file No. E64380 (as model coupled to a phototransistor. No. PC814) ( ) It is packaged in a 4pin DIP, available in SMT gullw- 2. Approved by VDE (DIN EN60747-5-2 ) (as an op- ing lead-form option. tion), file No. 40008087 (as model No. PC814) Input-output isolation voltage(rms) is 5.0kV. 3. Package resin : UL flammability grade (94V-0) Collector-emitter voltage is 80V and CTR is 20% to () DIN EN60747-5-2 : successor standard of DIN VDE0884 300% at input current of 1mA. Features Applications 1. 4pin DIP package 1. Programmable controllers 2. Double transfer mold package (Ideal for Flow Solder- 2. Telephone sets, telephone exchangers ing) 3. System appliances 3. AC input type 4. Signal transmission between circuits of different po- 4. High collector-emitter voltage (V : 80V) CEO tentials and impedances 5. Current transfer ratio (CTR : MIN. 20% at I =1mA, F V =5V) CE 6. High isolation voltage between input and output (V : 5.0 kV) iso(rms) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D2-A03503EN 1 Date Sep. 1. 2006 SHARP CorporationPC814XJ0000F Series Internal Connection Diagram 1 Anode/Cathode 1 4 2 Cathode/Anode 3 Emitter 2 3 4 Collector (Unit : mm) Outline Dimensions 1. Through-Hole [ex. PC814XJ0000F] 2. Through-Hole (VDE option) [ex. PC814XNYJ00F] Rank mark Rank mark Primary side mark Primary side mark Factory identification mark Factory identification mark Date code Date code 1 4 1 4 PC814 PC814 2 3 2 3 4 SHARP mark 0.5 6.5 0.5 6.5 VDE Indenfication mark 0.30 0.50 7.62 4.58 0.30 0.50 7.62 4.58 Epoxy resin Epoxy resin 0.10 0.1 0.26 0.5 0.10 0.1 0.26 0.5 : 0 to 13 : 0 to 13 Product mass : approx. 0.23g Product mass : approx. 0.23g 3. SMT Gullwing Lead-Form [ex. PC814XPJ000F] Primary side Rank mark mark Factory identification mark Date code 1 4 2 3 PC814 0.5 6.5 0.50 0.30 4.58 7.62 Epoxy resin 0.25 +0.4 +0.4 2.54 1.0 1.00.0 0.0 +0.0 10.00.5 Product mass : approx. 0.22g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A03503EN 2 0.3 0.3 1.2 1.2 0.2 0.10 0.2 0.6 0.26 0.6 0.25 2.54 0.50 0.25 4.58 0.25 0.35 2.54 0.5 0.50 2.7 4.58 0.5 0.5 3.0 3.5 TYP. 0.5 0.5 3.5 0.3 1.2 0.2 0.6 0.25 2.54 0.50 4.58 0.5 2.7 0.5 0.5 3.0 3.5 TYP. 0.5

Tariff Desc

8541.50.00 - Other semiconductor devices (not IC) semiconductor devices
SHARP ASIA
Sharp Electronics
Sharp Microelectronics
SharpMicroelectronics
SHP

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