Product Information

SX-SDPGN-2830-SP

SX-SDPGN-2830-SP electronic component of Silex

Datasheet
RF Transceiver SX-SDPGN-2830-SP: 10 Piece Sample Pack - 802.11bgn single band surface mount wireless SIP designed for low power embedded wireless applications.

Manufacturer: Silex
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 227.9605 ea
Line Total: USD 227.96

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 409.6662
2 : USD 379.3206
4 : USD 379.3206
5 : USD 379.3206
15 : USD 379.3206

     
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SX-SDPGN 802.11b/g/n SiP for Mobile Applications Lowest Cost 802.11n Wireless LAN Solution The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third- Features: generation Wireless LAN solution, featuring 802.11n. Based on the IEEE 802.11b/g/n 2.4 GHz game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power e ciency to portable Integrated CMOS E cient Power Ampli er (EPA), LNA devices including patient monitors, printers, handheld terminals Adaptive radio biasing for low-power or high-performance modes and more. Industry-leading receive sensitivity The SX-SDPGN is ideal for high volume Wireless LAN applications. The SX-SDPGN is a System-in-Package (SiP) designed to be No external EEPROM required for RF calibration mounted directly on the device PCBA. This design approach Integrated RISC processor minimizes cost by eliminating extra materials (i.e. PCB and connectors) and labor associated with a radio module or card. Support for industry standard QoS schemes (802.11e, WMM, WMM-PS) Bene ts: Hardware accelerated security, including WAPI (China) High RBOM integration enables design exibility and lowest cost Smallest foot print for space constrained devices Target Applications: Direct antenna connection eliminates the need for complicated RF tuning and calibration The SX-SDPGN is ideal for any high volume portable device where there is a requirement to achieve the lowest BOM cost or smallest foot print. Implementation of a System-in-Package solution is recommended for companies that have RF hardware Solution Highlights: expertise. Software driver and supplicant development is also The SX-SDPGN incorporates all the features and performance of the generally required. award winning Qualcomm Atheros ROCm AR6003 solution, including: Speci cations: Single-stream 802.11n for faster downloads, longer range, and lower power consumption Product Name SX-SDPGN-2830 The highest actual end-user throughput-over-range utilizing Chipset Qualcomm Atheros AR6103 advanced 802.11n features including: full & half guard interval, hardware acelerated frame aggregation, space time block Operating Voltage VDD 3.3V, AVDD 1.8v coding (STBC), and low density parity check (LDPC) encoding Dimensions 8.3 x 9.2 x 1.015 mm Highest level of on-chip integration using CMOS technology Storage Temperature -45 to +135 degrees C - Radio/MAC/Baseband - Patented Qualcomm Atheros E cient Power Ampli er Operating Temperature -20 to +85 degrees C TM (EPA ) for high transmitter output power - Integrated power management unit Direct Connect AP Mode technology Qualcomm Atheros Universal Wireless Cooperation for enhanced Wireless/Bluetooth Cooperation PN: 141-00207-100 REV C. 20120918SX-SDPGN 802.11b/g/n System in Package (SiP) Dimensions and Architecture 8.3 mm 9.2 mm 1.015 mm General Speci cations Interfaces On-Chip Functionality: Single-chip MAC/BB/RF/PA/LNA Communications: SDIO 2.0 Frequency Band: 2.4 GHz Supported Data Rate: IEEE 802.11b 1 - 11 Mbps Network Standard: 802.11b, 802.11g, 802.11n (1-stream) IEEE 802.11g 6 - 54 Mbps Modulation Modes: CCK and OFDM with BPSK, QPSK, IEEE 802.11n 7.2 - 72.2 Mbps 16 QAM, 64 QAM Bluetooth Coexistence Supports 2-, 3-, and 4-wire handshaking Hardware Encryption: WEP, WPA/WPA2, (AES and TKIP), WAPI Physical Speci cations 8.3 mm x 9.2 mm LGA Package Quality of Service (QoS): WMM, WMM-PS, 802.11e Driver Support Ordering Information Reference Drivers: SX-SDPGN-2830: Bulk Packaged, Tape / Reel - Linux SX-SDPGN-2830-SP: 10 Unit Sample Pack - Android SX-6K3-EVK-SB: AR6003 Single Band Evaluation Kit - Windows Embedded Compact 7 - QNX Neutrino - Green Hills Intergrity - Mentor Graphics Nucleus silex technology is a registered trademark of silex technology, Inc. Other product or brand names may be registered trademarks or trademarks of their respective owners. Technical information and speci cations are subject to change without notice. 2012 silex technology, Inc. All rights reserved. silex global sales & support locations Corporate Headquarters US O ce Europe O ce silex technology, Inc. silex technology america, Inc. silex technology europe, GmbH +1-801-748-1199 +49-2159-65009-0 +81-774-98-3781 www.silex.jp US toll free 866-765-8761 www.silexeurope.com www.silexamerica.com contact silexeurope.com support silex.jp sales silexamerica.com PN: 141-00207-100 REV C. 20120918

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

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