Product Information

BGM111A2-V2-P1071

BGM111A2-V2-P1071 electronic component of Silicon Labs

Datasheet
Bluetooth Modules - 802.15.1

Manufacturer: Silicon Labs
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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0 - WHS 1

MOQ : 2000
Multiples : 1

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BGM111A2-V2-P1071
Silicon Labs

2000 : USD 7.41
20000 : USD 7.2425
200000 : USD 6.2635
1000000 : USD 5.7507
2000000 : USD 5.7468
N/A

     
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RoHS - XON
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Frequency
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
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Antenna Connector Type
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Supply Current Receiving
Supply Current Transmitting
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WGM110 Wizard Gecko Wi-Fi Module Data Sheet The Wizard Gecko WGM110 is an all-inclusive Wi-Fi Module targeted for applications KEY POINTS where good RF performance, low-power consumption, and easy application develop- ment, together with fast time to market, are key requirements. WGM110 has excellent RF performance and can provide long range with robust wireless connectivity. Module variants WGM110A (chip antenna) The WGM110 Module integrates all of the necessary elements required for an IoT Wi-Fi WGM110E (u.FL connector) application, including an 802.11b/g/n radio, integrated chip antenna (WGM110A) or an 802.11b/g/n compliant u.FL connector for an external antenna (WGM110E), certifications, a microcontroller, TX power: +16 dBm Wi-Fi and IP stacks, an HTTP server, and multiple protocols, such as TCP and UDP. RX sensitivity: -98 dBm WGM110 can act as a Wi-Fi client or be used as a Wi-Fi access point, making the provi- Range: up to 450 m sioning of the device as easy as surfing on the web. WGM110 can host BGScript end CPU core: 32-bit ARM Cortex-M3 user applications, which means applications can be designed without relying on an ex- Flash memory: 1 MB ternal microcontroller. Alternatively, the Wi-Fi Module can run in Network Co-Processor RAM: 128 kB (NCP) mode, leaving the complexity of TCP/IP networking to the Module so that the cus- tomers own host controller can be fully dedicated to processing the customer applica- Modular certification tion tasks. The WGM110 Module also has highly flexible hardware interfaces which al- FCC lows connection to different peripherals and sensors. IC Japan In addition to the Wi-Fi Module itself, Silicon Labs offers support to guide and help de- Korea velopers in using WGM110 to build IoT applications, enabling a quick time to market. CE compliant End-to-end security Can host applications Small size: 21.0 x 14.4 x 2.0 mm silabs.com Building a more connected world. Rev. 1.5 Table of Contents 1. Key Features ...............................5 2. Pinout..................................6 2.1 Power, Ground and Reset Pads........................6 2.2 Peripherals and GPIOs...........................7 2.2.1 Peripheral and GPIO Pads .......................7 2.2.2 Peripheral Locations .........................8 2.2.3 GPIO Port Pins ...........................10 2.2.4 GPIO Input and Output Modes ......................10 2.2.5 Interrupt Pins............................10 2.3 Debug and RF Test Pads..........................10 3. Interfaces................................ 12 3.1 Host Interfaces .............................12 3.1.1 UART ..............................12 3.1.2 SPI ...............................14 3.1.3 USB...............................15 3.2 Peripheral Interfaces and Functions ......................16 3.2.1 USART (UART/SPI)..........................17 2 3.2.2 I C ...............................17 3.2.3 Timer / PWM ............................17 3.2.4 Analog to Digital Converter (ADC).....................17 3.3 Firmware Update and RF Test Interfaces.....................17 3.3.1 ARM Serial Wire Debug (SWD)......................17 3.3.2 Device Firmware Upgrade (DFU) .....................18 3.3.3 RF Test Interface...........................18 3.3.4 Reference Schematic for SWD Debug and RF Test Interfaces ...........18 3.4 Real Time Counter (RTC)..........................18 4. Module Software ............................. 19 5. Hardware Design Guidelines ........................21 5.1 Power Supply Requirements.........................21 5.2 PCB Design Guidelines ..........................21 5.3 Antenna Design Guidelines .........................22 5.3.1 Effect of Plastic and Metal Materials ....................22 5.3.2 Locating the Module Close to Human Body ..................23 6. Electrical Characteristics.......................... 24 6.1 Absolute Maximum Ratings .........................24 6.2 Recommended Operating Conditions......................24 6.3 Input/Output Terminal Characteristics......................24 6.4 Power-on Reset .............................25 6.5 Analog Digital Converter (ADC)........................25 silabs.com Building a more connected world. Rev. 1.5 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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