TS8 EMBER EM3X MODULE TECHNICAL SPECIFICATION Silicon Labs EM3x development kits contain various modules designed around the EM3x family of ICs. All of these modules are designed and sold by Silicon Labs module partners Telegesis (UK) Limited and California Eastern Laboratories (CEL). The module designs allow them to be integrated into any product without the need for RF experience and expertise. Utilizing stacks such as Silicon Labs certified ZigBee network stack EmberZNet, these modules enable a developer to add powerful wireless networking capability to products and quickly bring them to market. This document provides the technical specification of the EM3x modules on its Silicon Labs-specific carrier board. For more information on the other Telegesis modules, contact Telegesis, Ltd directly at www.telegesis.com. For more information on other CEL modules, contact CEL directly at meshconnect.cel.com. New in This Revision Added CEL CE compliance information. Contents 1 EM3x Module Definitions ................................................................................................................................. 2 2 EM3x Module Features ................................................................................................................................... 3 3 Performance Characteristics ........................................................................................................................... 3 4 EM3x Configurations ....................................................................................................................................... 5 5 Mechanical Details .......................................................................................................................................... 7 5.1 EM3x Module Interface Connector ........................................................................................................... 8 Rev 1.4 Copyright 2015 by Silicon Laboratories TS8 TS8 1 EM3x Module Definitions To accommodate the requirements of the different markets, Telegesis and CEL have developed a series of pin- compatible modules based on the Ember EM341, EM346, EM357, and EM3588 chipsets. Table 1 defines the Telegesis, CEL, and Silicon Labs part numbers for each module as well as describes the differences (Power Amplifier (PA), Low Noise Amplifier (LNA), and RF connection) between each module. Table 1. Silicon Labs and Module Partner Part Numbers PA / Module Partner P/N LNA Silicon Labs Silicon Labs Orderable EM3x Module RF Connection P/N Part Number (OPN) IC Partner (Module only) (Long Range) 110-0740-000 EM341-MOD-ANT-C EM341 CEL ZICM341SP0-1 Antenna No 110-0741-000 EM341-MOD-RF-C EM341 CEL ZICM341SP0-1C Connector No 110-0742-000 EM346-MOD-ANT-C EM346 CEL ZICM346SP0-1 Antenna No 110-0743-000 EM346-MOD-RF-C EM346 CEL ZICM346SP0-1C Connector No 110-0720-000 EM357-MOD-ANT-T EM357 Telegesis ETRX357 SMT Antenna No 110-0721-000 EM357-MOD-RF-T EM357 Telegesis ETRX357HR Mini-RF Connector No 110-0722-000 EM357-MOD-LR-RF-T EM357 Telegesis ETRX357HR-LRS Mini-RF Connector Yes 110-0723-000 EM357-MOD-LR-ANT-T EM357 Telegesis ETRX357-LRS SMT Antenna Yes 110-0730-000 EM357-MOD-ANT-C EM357 CEL ZICM357SP0-1 SMT Antenna No 110-0731-000 EM357-MOD-RF-C EM357 CEL ZICM357SP0-1C Mini-RF Connector No 110-0732-000 EM357-MOD-LR-RF-C EM357 CEL ZICM357SP2-1C Mini-RF Connector Yes 110-0733-000 EM357-MOD-LR-ANT-C EM357 CEL ZICM357SP2-1 SMT Antenna Yes 110-0734-000 EM3588-M-AN-C EM3588 CEL ZICM3588SP0-1 SMT Antenna No 110-0735-000 EM3588-MOD-RF-C EM3588 CEL ZICM3588SP0-1C Mini-RF Connector No 110-0736-000 EM3588-MLR-RF-C EM3588 CEL ZICM3588SP2-1C Mini-RF Connector Yes 110-0737-000 EM3588-MLR-AN-C EM3588 CEL ZICM3588SP2-1 SMT Antenna Yes All of these modules are available from Telegesis and CEL. Silicon Labs provides the CEL EM357 and EM3588 module types with the EM35x Development Kit (part number EM35X-DEV) and the EM341 and EM346 modules with the EM34x Development Kit (part number EM34X-DEV). For modules whose RF connection is a mini-RF connector, an RF adapter cable (Tyco/Amp part number 2032440- 1) can be used to interface the module to external test equipment. One of these RF adapter cables is included with the development kits. To connect to the EM35x breakout board (Silicon Labs P/N: 130-0680-000), each module shown in Table 1 is soldered to a small carrier board. The carrier board connector is discussed in section 5.1, EM3x Module Interface Connector. 2 Rev. 1.4