DEV-13735

Part Number: XZM2CRKM2DGFBB45SCCB 3.5 x 2.8mm PLCC4 SMD LED Features Package Schematics Ideal for indication light on hand held products Long life and robust package Standard Package: 2000pcs/ Reel MSL (Moisture Sensitivity Level): 3 Halogen-free RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01 ) unless otherwise noted. 3. Specifications are subject to change without notice. Red Green Blue zAbsolute Maximum Red Green Blue Operating Characteristics (AlGaIn (InGa (InGa Unit Ratings (AlGaIn (InGa (InGa Unit (TA=25C) P) N) N) (T =25C) P) N) N) A Forward Voltage (Typ.) Reverse Voltage VR 5 5 5 V V 2.2 3.2 3.3 V F (IF=20mA) Forward Current IF 50 30 30 mA Forward Voltage (Max.) VF 2.8 4.0 4.0 V (I =20mA) F Forward Current (Peak) 1/10 Duty Cycle i 150 100 100 mA FS Reverse Current (Max.) I 10 50 50 A R 0.1ms Pulse Width (VR=5V) Power Dissipation P 140 120 120 mW D Wavelength of Peak Emission CIE127-2007* P 640* 520* 465* nm Electrostatic Discharge (Typ.) 3000 450 250 V Threshold (HBM) (IF=20mA) Operating Temperature TA Wavelength of Dominant -40 ~ +85 C Emission CIE127-2007* (Typ.) D 625* 525* 470* nm Storage Temperature Tstg (IF=20mA) A Relative Humidity between 40% and 60% is recommended in Spectral Line Full Width ESD-protected work areas to reduce static build up during assembly At Half-Maximum (Typ.) 20 35 22 nm process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) (IF=20mA) Capacitance (Typ.) C 27 100 100 pF (V =0V, f=1MHz) F Luminous Intensity Wavelength Viewing Part Emitting Emitting Lens-color CIE127-2007* CIE127-2007* Angle Number Color Material (I =20mA) mcd nm P 2 1/2 F min. typ. Red AlGaInP 400* 497* 640* XZM2CRKM2DGFBB45SCCB Green InGaN Water Clear 1000* 1590* 520* 120 Blue InGaN 200* 327* 465* *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Dec 05, 2020 XDSB7866 V6-Z Layout: Maggie L. P. 1/5 Part Number: XZM2CRKM2DGFBB45SCCB 3.5 x 2.8mm PLCC4 SMD LED Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of 2 leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Dec 05, 2020 XDSB7866 V6-Z Layout: Maggie L. P. 2/5