BALF-CC25-02D3 STMicroelectronics

BALF-CC25-02D3 electronic component of STMicroelectronics
BALF-CC25-02D3 STMicroelectronics
BALF-CC25-02D3 Signal Conditioning
BALF-CC25-02D3  Passive Components
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X-On Electronics has gained recognition as a prominent supplier of BALF-CC25-02D3 Signal Conditioning across the USA, India, Europe, Australia, and various other global locations. BALF-CC25-02D3 Signal Conditioning are a product manufactured by STMicroelectronics. We provide cost-effective solutions for Signal Conditioning, ensuring timely deliveries around the world.

Part No.BALF-CC25-02D3
Manufacturer:STMicroelectronics
Category:Signal Conditioning
Description:Signal Conditioning DFD PROTECTION & FILTER
Datasheet:BALF-CC25-02D3 Datasheet (PDF)
Shipping Charges:Click here for details
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We are delighted to provide the BALF-CC25-02D3 from our Signal Conditioning category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BALF-CC25-02D3 and other electronic components in the Signal Conditioning category and beyond.

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BALF-CC25-02D3 50 ohm, conjugate match to CC2541 transformer balun Datasheet production data Description STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers. Its a design using STMicroelectronics IPD (integrated passive device) technology on non- conductive glass substrate to optimize RF )OLS &KLS SDFNDJH performance. EXPSV Figure 1. Pin configuration (top view) Features 2.45 GHz balun with integrated matching 5)B1 6( network Matching optimized for following CC2541 Low insertion loss = Low amplitude imbalance *1 Low phase imbalance 5)B3 % Coated Flip-Chip on glass Small footprint: < 0.88 mm Benefits Figure 2. Application schematic (top view) Very low profile High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability November 2015 DocID028619 Rev 1 1/11 This is information on a product in full production. www.st.com 11Characteristics BALF-CC25-02D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Symbol Parameter Value Unit P Input power RF 20 dBm IN IN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 , air discharge) 2000 V ESD ratings machine model (MM: C = 200 pF, R = 25 , L = 500 nH) 500 V ESD ESD ratings charged device model (CDM, JESD22-C101D) 500 T Operating temperature -40 to + 105 C OP Table 2. Electrical characteristics - RF performance (T = 25 C) amb Value Symbol Parameter Unit Min. Typ. Max. Z Nominal differential output impedance Conjugate match to CC2541 OUT Z Nominal input impedance 50 IN F Frequency range (bandwidth) 2379 2507 I Insertion loss in bandwidth 1.6 1.8 dB L R Single ended return loss in bandwidth 9 10 dB L SE R Differential ended return loss in bandwidth 9 17 dB L DIFF Phase imbalance 7 imb A Amplitude imbalance 0.6 dB imb 2/11 DocID028619 Rev 1

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN
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