LSM330DL

LSM330DL Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor Preliminary data Features Analog supply voltage 2.4 V to 3.6 V Digital supply voltage I/Os, 1.8V Low-power mode Power-down mode LLGA 28L 7.5 x 4.4 x 1.1 mm 3 independent acceleration channels and 3 STs family of modules leverages a robust and angular rate channels mature manufacturing process already used for 2g/4g/8g/16g dynamic, selectable full- the production of micromachined accelerometers. scale acceleration range The various sensing elements are manufactured 250/500/2000 dps dynamic, selectable full- using specialized micromachining processes, scale angular rate while the IC interfaces are based on CMOS 2 SPI/I C serial interface (16-bit data output) technology that allows designing a dedicated Programmable interrupt generator for free-fall circuit which is trimmed to better match the and motion detection sensing element characteristics. ECOPACK , RoHS, and Green compliant The LSM330DL has a dynamic, user-selectable full-scale acceleration range of 2g/4g/8g/16g and an angular rate of 250/500/2000 deg/sec. Applications The accelerometer and gyroscope sensors can GPS navigation systems be either activated or put in low-power / power- Impact recognition and logging down mode separately for power-saving optimized applications. The LSM330DL is Gaming and virtual reality input devices available in a plastic land grid array (LGA) Motion-activated functions package. Intelligent power saving for handheld devices Several years ago ST successfully pioneered the Vibration monitoring and compensation use of this package for accelerometers. Today, ST Free-fall detection has the broadest manufacturing capability in the world and unrivalled expertise for the production 6D-orientation detection of sensors in a plastic LGA package. Description The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. Table 1. Device summary Part number Temperature range C Package Packing LSM330DL -40 to +85 LGA-28 Tray LSM330DLTR -40 to +85 LGA-28 Tape & reel July 2011 Doc ID 022018 Rev 1 1/54 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to www.st.com 54 change without notice. Obsolete Product(s) - Obsolete Product(s)Contents LSM330DL Contents 1 Block diagram and pin description . 9 1.1 Block diagram . 9 1.2 Pin description . 10 2 Module specifications . 12 2.1 Mechanical characteristics 12 2.2 Electrical characteristics 13 2.3 Temperature sensor characteristics . 13 2.4 Communication interface characteristics . 14 2.4.1 SPI - serial peripheral interface . 14 2.4.2 I2C - inter-IC control interface 15 2.5 Absolute maximum ratings 16 2.6 Terminology . 17 2.6.1 Sensitivity 17 2.6.2 Zero level 17 3 Functionality 18 3.1 Factory calibration 18 4 Application hints . 19 4.1 External capacitors 19 4.2 Soldering information 20 5 Digital interfaces . 21 5.1 I2C serial interface 21 5.1.1 I2C operation . 22 5.2 SPI bus interface . 24 5.2.1 SPI read . 25 5.2.2 SPI write 25 5.2.3 SPI read in 3-wire mode 26 6 Register mapping 27 2/54 Doc ID 022018 Rev 1 Obsolete Product(s) - Obsolete Product(s)