MP23AB01DHTR

MP23AB01DH High-performance MEMS audio sensor: fully differential analog bottom-port microphone Datasheet - production data Description The MP23AB01DH is a compact, low-power microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP23AB01DH has sensitivity of 38 dB 1 dB, an acoustic overload point of 135 dBSPL with minimum 65 dB signal-to-noise ratio. The MP23AB01DH has fully differential output in order to minimize common mode noise. Features Single supply voltage operation The MP23AB01DH is available in a package Fully differential output compliant with reflow soldering and is guaranteed Omnidirectional sensitivity to operate over an extended temperature range from -40 C to +85 C. High signal-to-noise ratio High bandwidth Table 1: Device summary Package compliant with reflow soldering Temp. range Order code Package Packing High RF immunity (C) ECOPACK , RoHS, and Green compliant (3.35 x 2.5 x 0.98) MP23AB01DH -40 to +85 Tray mm (3.35 x 2.5 x 0.98) Tape and MP23AB01DHTR -40 to +85 mm reel August 2017 DocID030017 Rev 2 1/12 www.st.com This is information on a product in full production. Contents MP23AB01DH Contents 1 Pin description ................................................................................ 3 2 Acoustic and electrical specifications ........................................... 4 2.1 Acoustic and electrical characteristics ............................................... 4 2.2 Frequency response ......................................................................... 5 3 Absolute maximum ratings ............................................................. 6 4 Application recommendations ....................................................... 7 4.1 MP23AB01DH schematic hints ......................................................... 7 5 Package information ....................................................................... 8 5.1 Soldering information ........................................................................ 8 5.2 RHLGA 4-lead package information .................................................. 9 6 Reliability tests .............................................................................. 10 7 Revision history ............................................................................ 11 2/12 DocID030017 Rev 2