MP34DT04 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Gaming and virtual reality input devices Digital still and video cameras Antitheft systems Description The MP34DT04 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. Features The IC interface is manufactured using a CMOS Single supply voltage process that allows designing a dedicated circuit Low power consumption able to provide a digital signal externally in PDM format. 120 dBSPL acoustic overload point 64 dB signal-to-noise ratio The MP34DT04 has an acoustic overload point of Omnidirectional sensitivity 120 dBSPL with a 64 dB signal-to-noise ratio and 26 dBFS sensitivity 26 dBFS sensitivity. PDM output The MP34DT04 is available in a top-port, SMD- HCLGA package compliant, EMI-shielded package and is Top-port design guaranteed to operate over an extended SMD-compliant temperature range from -40 C to +85 C. EMI-shielded Table 1: Device summary ECOPACK , RoHS, and Green compliant Temp. Order codes Package Packing range C Applications HCLGA Mobile terminals MP34DT04 -40 to +85 Tray (3x4 x1.095 mm) Laptop and notebook computers 4LD Portable media players HCLGA Tape and VoIP MP34DT04TR -40 to +85 (3x4x1.095 mm) reel Speech recognition 4LD A/V eLearning devices November 2016 DocID027586 Rev 3 1/21 www.st.com This is information on a product in full production.Contents MP34DT04 Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications........................................... 6 2.1 Acoustic and electrical characteristics............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Application recommendations ....................................................... 9 4 Carrier tape mechanical specifications .......................................11 5 Process recommendations ........................................................... 12 6 Sensing element............................................................................14 7 Absolute maximum ratings...........................................................15 8 Functionality..................................................................................16 8.1 L/R channel selection......................................................................16 9 Package information .....................................................................17 9.1 Soldering information ......................................................................17 9.2 HCLGA package information...........................................................18 10 Revision history ............................................................................20 2/21 DocID027586 Rev 3