CH201-00ABR TDK

CH201-00ABR electronic component of TDK
CH201-00ABR TDK
CH201-00ABR Distance Sensor ICs & Embedded Modules
CH201-00ABR  Robotics and Prototyping
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of CH201-00ABR Distance Sensor ICs & Embedded Modules across the USA, India, Europe, Australia, and various other global locations. CH201-00ABR Distance Sensor ICs & Embedded Modules are a product manufactured by TDK. We provide cost-effective solutions for Distance Sensor ICs & Embedded Modules, ensuring timely deliveries around the world.

Part No.CH201-00ABR
Manufacturer:TDK
Category:Distance Sensor ICs & Embedded Modules
Description:Distance Sensors Long Range Ultra-low Power Ultrasonic Time-of-Flight Range Sensor
Datasheet:CH201-00ABR Datasheet (PDF)
Shipping Charges:Click here for details
AI Image
Price (USD)
  
1: USD 10.3446 ea
Line Total: USD 10.34 
Availability : 5860
  
Ship by Fri. 19 Jun to Tue. 23 Jun
QtyUnit Price
1$ 10.3446
10$ 7.5999
25$ 7.1148
50$ 6.9184
100$ 6.5026
250$ 6.364
500$ 6.0984
1000$ 6.0522
5000$ 6.0522
  

Availability5860
Ship by Fri. 19 Jun to Tue. 23 Jun
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 10.3446
10$ 7.5999
25$ 7.1148
50$ 6.9184
100$ 6.5026
250$ 6.364
500$ 6.0984
1000$ 6.0522
5000$ 6.0522

   
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Product Category
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We are delighted to provide the CH201-00ABR from our Distance Sensor ICs & Embedded Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CH201-00ABR and other electronic components in the Distance Sensor ICs & Embedded Modules category and beyond.

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CH201 Long-Range Ultrasonic Time-of-Flight Range Sensor CH201 HIGHLIGHTS FEATURES CH201 is a miniature, ultra-low power, long-range ultrasonic Fast, accurate range-finding Time-of-Flight (ToF) range sensor. Based on Chirps patented Operating range from 20 cm to 5m MEMS technology, the CH201 is a system-in-package that Programmable modes optimized for long or integrates a PMUT (Piezoelectric Micromachined Ultrasonic short-range sensing applications Transducer) together with an ultra-low power SoC (System on Customizable field of view (FoV) up to 180 Chip) in a miniature, reflowable package. The SoC runs Chirps Multi-object detection advanced ultrasonic DSP algorithms and includes an integrated Works in any lighting condition, including full 2 microcontroller that provides digital range readings over I C. sunlight to complete darkness Insensitive to object color, detects optically Complementing Chirps CH101 ultrasonic ToF sensor product, transparent surfaces (glass, clear plastics etc.) CH201 provides accurate range measurements to targets at Easy to integrate distances up to 5m. Based on ultrasonic pulse-echo Single sensor for receive and transmit measurements, the sensor works in any lighting condition, including full sunlight, and provides millimeter-accurate range Single 1.8V supply measurements independent of the targets color and optical I2C Fast Mode compatible interface, data-rates up to 400 kHz transparency. The sensors Field-Of-View (FOV) can be customized and enables simultaneous range measurements to Dedicated programmable range interrupt pin multiple objects in the FOV. Many algorithms can further Platform-independent software driver enables process the range information for a variety of usage cases in a turnkey range-finding wide range of applications. Miniature integrated package 3.5 mmx 3.5mm x 1.26mm, 8-pin LGA package Compatible with standard SMD reflow Low-power SoC running advanced ultrasound firmware Operating temperature range: -40C to 85C Ultra-low supply current DEVICE INFORMATION 1 sample/s: PART NUMBER o 7.5 A (1 m max range) PACKAGE LID OPENING o 13.5 A (5 m max range) CH201-00ABR 3.5 x 3.5 x 1.26 mm LGA 1-Hole 25 samples/s: RoHS and Green-Compliant Package o 63 A (1 m max range) o 247 A (5 m max range) APPLICATIONS User presence in Home/Building Automation and Personal Electronics Obstacle avoidance Robotics and Drones Ultra-low power remote presence-sensing nodes Augmented/Virtual Reality and Gaming Gesture control Liquid level sensing & shelf inventory monitoring Chirp Microsystems Document Number: DS-000379 2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A Chirp Microsystems reserves the right to change Revision: 1.1 +1(510) 6408155 specifications and information herein without notice. Release Date: 09/22/2020 www.chirpmicro.com CH201 Table of Contents CH201 HIGHLIGHTS .................................................................................................................................................................................... 1 DEVICE INFORMATION ................................................................................................................................................................................. 1 APPLICATIONS ............................................................................................................................................................................................ 1 FEATURES .................................................................................................................................................................................................. 1 1 Simplified Block Diagram ....................................................................................................................................................... 3 1.1 ABSOLUTE MAXIMUM RATINGS ......................................................................................................................................................... 3 2 Package Information .............................................................................................................................................................. 4 2.1 8-PIN LGA .................................................................................................................................................................................... 4 2.2 PIN CONFIGURATION ....................................................................................................................................................................... 4 2.3 PIN DESCRIPTION ............................................................................................................................................................................ 4 2.4 PACKAGE DIMENSIONS ..................................................................................................................................................................... 5 3 Electrical Characteristics ........................................................................................................................................................ 6 3.1 ELECTRICAL CHARACTERISTICS (CONTD) .............................................................................................................................................. 7 4 Typical Operating Characteristics ........................................................................................................................................... 8 5 Detailed Description .............................................................................................................................................................. 9 5.1 THEORY OF OPERATION .................................................................................................................................................................... 9 5.2 DEVICE CONFIGURATION .................................................................................................................................................................. 9 6 Applications ......................................................................................................................................................................... 10 6.1 CHIRP CH201 DRIVER ................................................................................................................................................................... 10 6.2 OBJECT DETECTION ....................................................................................................................................................................... 10 6.3 INTERFACING TO THE CH201 ULTRASONIC SENSOR ........................................................................................................................... 10 6.4 DEVICE MODES OF OPERATION ....................................................................................................................................................... 11 Free-Running Mode ............................................................................................................................................................................................... 11 Hardware-Triggered Mode .................................................................................................................................................................................... 11 CH201 Beam Patterns ............................................................................................................................................................................................ 11 6.5 LAYOUT RECOMMENDATIONS .......................................................................................................................................................... 12 Recommended PCB Footprint................................................................................................................................................................................ 12 6.6 PCB REFLOW RECOMMENDATIONS: ................................................................................................................................................. 13 Use of Level Shifters ............................................................................................................................................................................................... 13 6.7 TYPICAL OPERATING CIRCUITS ......................................................................................................................................................... 13 7 Ordering Information ........................................................................................................................................................... 15 7.1 PART NUMBER DESIGNATION .......................................................................................................................................................... 15 7.2 PACKAGE MARKING ....................................................................................................................................................................... 15 7.3 TAPE & REEL SPECIFICATION ........................................................................................................................................................... 16 7.4 SHIPPING LABEL ............................................................................................................................................................................ 16 8 Revision History ................................................................................................................................................................... 17 Page 2 of 18 Document Number: DS-000379 Revision: 1.1

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