Tronics Microsystems S.A. 98 rue du Pr de lHorme, 38920 Crolles, France Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51 www.tronicsgroup.com GYPRO2300 Datasheet MCD001-B Features Digital angular rate sensor with SPI interface Angular rate measurement around Z-axis (yaw) 300/sec input range Ultra low noise Excellent bias instability 24 bit angular rate output Embedded temperature sensor for on-chip or external temperature compensation General Description Built-in Self-Test 5V single supply voltage GYPRO product line is a new generation of Micro-Electro- Low operating current consumption: 25mA Mechanical Systems (MEMS) angular rate sensor specifically CLCC 30 package: 19.6 mm x 11.5 mm x 2.9 mm designed for demanding applications. Weight : 2 grams The MEMS transducer is manufactured using Tronics REACH and RoHS compliant proprietary vacuum wafer-level packaging technology based on micro-machined thick single crystal silicon. The integrated circuit (IC) provides a stable primary anti- phase vibration of the drive proof masses, thanks to electrostatic comb drives. When the sensor is subjected to a Applications rotation, the Coriolis force acts on the sense proof masses Precision instrumentation and forces them into a secondary anti-phase movement Platform stabilization and control perpendicular to the direction of drive vibration, which is itself Unmanned vehicles counter-balanced by electrostatic forces. The sense closed GPS assistance loop operates as an electromechanical modulator providing a digital output. This output is finally demodulated using the drive reference signal. The sensor is factory calibrated and compensated for temperature effects to provide high-accuracy digital output over a broad temperature range. Raw data output can be also chosen to enable customer- made compensations. GYPRO Product references Description Vibration range Bandwidth Data Rate Latency GYPRO2300 Standard configuration 4 grms 100Hz 200Hz 40 ms GYPRO2300LD Low delay configuration 4 grms >200Hz 1700Hz 2 ms GYPRO3300 Improved vibration tolerance & 8 grms >200Hz 1800Hz 1 ms Ultra low delay configuration Disclaimer Information furnished by Tronics is believed to be accurate and reliable. However, no responsibility is assumed by Tronics for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specification subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Tronics. Trademarks and registered trademarks are the property of their respective owners. Copyright 2017 Tronics Microsystems S.A.. All rights reserved. Internal ref. : MCD001-B Page 1 Specification subject to change without notice. Tronics Microsystems S.A. 98 rue du Pr de lHorme, 38920 Crolles, France Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51 www.tronicsgroup.com GYPRO2300 Datasheet Contents Features ............................................................................................................................................... 1 Applications .......................................................................................................................................... 1 General Description .............................................................................................................................. 1 Product references ............................................................................................................................... 1 Disclaimer ............................................................................................................................................. 1 Block diagram ............................................................................................................................................................................... 3 Overall Dimensions ....................................................................................................................................................................... 3 1. Specifications ............................................................................................................................... 4 2. Maximum Ratings ........................................................................................................................ 6 3. Typical performances ................................................................................................................... 7 4. Interface ...................................................................................................................................... 9 4.1. Pinout, sensitive axis identification ................................................................................................................................... 9 4.2. Application circuit .............................................................................................................................................................. 9 4.3. Input/Output Pin Definitions ........................................................................................................................................... 10 5. Soldering Recommendations ...................................................................................................... 11 6. Digital SPI interface .................................................................................................................... 12 6.1. Electrical and Timing Characteristics ............................................................................................................................... 12 6.2. SPI frames description ..................................................................................................................................................... 13 6.3. Angular rate readings ...................................................................................................................................................... 13 6.4. Temperature readings ..................................................................................................................................................... 13 6.5. Advanced use of SPI registers .......................................................................................................................................... 14 7. Angular rate calibration procedure ............................................................................................. 16 7.1. Algorithm overview ......................................................................................................................................................... 16 7.2. Programming of the new coefficients ............................................................................................................................. 17 7.3. Switch to uncompensated data output ........................................................................................................................... 17 8. Temperature Sensor Calibration Procedure ................................................................................ 18 8.1. Temperature sensor calibration model ........................................................................................................................... 18 8.2. Recommended Procedure ............................................................................................................................................... 18 9. Device Identification .................................................................................................................. 18 10. Internal construction and Theory of Operation ........................................................................... 19 11. Available Tools and Resources .................................................................................................... 20 Copyright 2017 Tronics Microsystems S.A.. All rights reserved. Page 2 Internal ref. : MCD001-B Specification subject to change without notice.