Chip Beads For power line ACC series Type: HFxxACC2012 0805 inch * HFxxACC3216 1206 inch HFxxACC3225 1210 inch HFxxACC4532 1812 inch * Dimensions Code EIA Issue date: September 2012 All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.(1/3) Conformity to RoHS Directive Chip Beads For Power Line ACC Series HFxxACC2012, HFxxACC3216, HFxxACC3225, HFxxACC4532 FEATURES With 4 types rated at 1.5A and 3 types rated at 3A, and with a range of frequency characteristics available for each type, the ACC series facilitates selection of the most appropriate part for any given application. Effective EMC suppression over a broad band can be achieved simply be inserting this product into the DC power line on the cir- cuit board. Available reflow soldering. It is a product conforming to RoHS directive. PRODUCT IDENTIFICATION SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM L HF70 ACC 201209 - T (1) (2) (3) (4) Terminal electrode Ferrite (1) Material name D (2) Series name (3) Dimension code Insulation resin (4) Packaging style No polarity T: 180mm reel taping Dimensions in mm TL: 330mm reel taping Type L W T D 201209 2.00.2 1.250.2 0.90.2 0.30.2 SPECIFICATIONS 321611 3.20.2 1.60.2 1.10.2 0.30.2 Operating temperature range 40 to +125C 322513 3.20.2 2.50.2 1.30.2 0.30.2 Storage temperature range 40 to +125C(After mount) 453215 4.50.25 3.20.25 1.50.25 0.30.2 Dimension without tolerance is reference value. PACKAGING STYLE AND QUANTITIES Packaging style Type Quantity RECOMMENDED PC BOARD PATTERN 201209 2000 pieces/reel REFLOW SOLDERING 321611 2000 pieces/reel Taping 322513 2000 pieces/reel 453215 1000 pieces/reel Resist HANDLING AND PRECAUTIONS ab a Land pattern Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference Dimensions in mm between the solder temperature and product temperature does Type a b c 201209 1.0 1.0 1.0 not exceed 150C. 321611 1.1 2.2 1.4 After mounting components onto the printed circuit board, do not 322513 1.1 2.2 2.3 apply stress through board bending or mishandling. 453215 1.5 3.0 3.0 Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The devices failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) All specifications are subject to change without notice. 001-03 / 20110929 / e9413 acc.fm T W c