z SFP+ PLUGGABLE I/O INTERCONNECT The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28 Gbps NRZ and 56 Gbps PAM-4. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is hotswappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+ connector for 10-16 Gbps data rates, establishing a progressive path to higher speedsan upgradeability that can result in longterm cost savings as this would eliminate the need to fully redesign for higher performance. The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire product family is offered as a dual source option with Molex. LLC. DATA AND DEVICES /// z SFP+ I/O INTERCONNECTzSFP+ Pluggable I/O Interconnect FEATURES Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet and 16 Gbps Fibre Channel Light pipe options include: Surface-mount connector design for single high 1xN cages Press-fit 1xN cages and stacked assemblies (connector and No light pipes cage) for one-step, easy PCB placement Coupled, narrow-edged, blanked- and formed-contact beam All 4 light pipes (shown left) geometry and insert molding for superior signal integrity, mechanical and electrical performance Inner light pipes Backwards-compatibility: Shares same mating interface and Outer light pipes standard cage dimensions with the SFP+ connector (connector/single high cages are also PCB footprint-compatible) Three light pipes Elastomeric gasket or spring finger options for EMI containment Outer light pipes reversed Single high cages (1xN) for design flexibility accommodates belly-to-belly applications for increased density and PCB space savings available in 1x1, 1x2, 1x3, 1x4 or 1x6 port configurations Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12 port Heat sinks, LEDs and plating choices offered Additional light pipe configurations available APPLICATIONS Telecommunications: Cellular infrastructure, central office uplink equipment, optical transport equipment, switches/ routers, access equipment (CMTS, PON, DSL, etc) Data Center: Data center switches and routers, servers, storage Medical: Medical diagnostic equipment Networking: Network interface, switches, routers Test and Measurement Equipment 20-Pin Surface-Mount Connector Electrical Voltage (max.): 120V AC Current (max.): 0.5A Dielectric Withstanding Voltage: 300V AC between contacts Mechanical Mating Force: 25N Unmating Force: 11.5N Durability (min.): 250 cycles Physical High-temperature thermoplastic housing (glass-filled, UL 94V-0 black) High-performance copper alloy contacts Plating: - Nickel underplating Tin plating on solder tail area Gold plating on mating area - Plating options: 15 and 30 Gold or Palladium Nickel o Operating Temperature: -40 to +85 C Follow IEEE802.3 cd (including trace) DATA AND DEVICES /// z SFP+ I/O INTERCONNECT PAGE 2