DIGITAL COMPONENT SENSOR DEVELOPMENT TOOLS Many of our digital sensor products are available in low power and small form factors. They are suited for wearable and miniature devices that are used to collect and share critical data for health monitoring, tness, air quality, aerospace, battery powered, and related applications. To increase knowledge sharing and reduce time to market, we have teamed with semiconductor manufacturers to design and provide plug and play tools for Xplained Pro Sensor Hub, MicroChip PicTail, and Digilent Pmod based development platforms. In addition, we off er several wireless demo/development tools to help engineers quickly achieve their design objectives with wireless applications. These tools are supported with software/ rmware drivers, documentation, and graphic user interfaces to make the development process easy. WIRELESS DEMO AND DEVELOPMENT KITS PICTAIL PLUS MEAS Environmental MEAS Wireless MEAS Wireless MEAS Wireless MEAS HTU21D(F), Sensor Tag M5600 Series U5600 Series FX1951 MS5637, MS8607, TSYS01* Type Humidity, Pressure Pressure Force Temperature, Pressure Type Humidity, Temperature, Pressure Speci cations 0 - 100% RH 50 - 15K psi 2 - 10K psi 0 - 50 lbf Speci cations 0 - 100% RH 20C to 85C Type G/S/C Type G/S/C/A -20C to 85C 300 to 1,200 mbar 300 to 1,200 mbar Communication Standard 2.4 GHz Standard 2.4 GHz Standard 2.4 GHz Standard 2.4 GHz wireless communication wireless communication wireless communication wireless communication TE Demo PicTail Plus Application iOS 7.0+ iOS 7.0+ iOS 7.0+ iOS 7.0+ Partner Board Microchip Explorer 16 Android 4.3+ Android 4.3+ Android 4.3+ Android 4.3+ *Temperature System Sensor (TSYS) Series PAGE 20 te.com/sensors Speci cations subject to change. Catalog SS-TS-TE100 DIGITAL COMPONENT SENSOR Dimensions for reference purpose only. 01/2016 DEVELOPMENT TOOLSDIGITAL COMPONENT SENSOR DEVELOPMENT TOOLS PERIPHERAL MODULES Digilent Pmod MEAS HTU21D(F) MEAS MS5637 MEAS MS8607 MEAS TSYS01* MEAS TSYS02D* MEAS KMA36(A) Type Humidity Pressure Pressure, Temperature Temperature Angular Position Temperature, Humidity Speci cations 0 to 100% RH 10 to 2,000 mbar 10 to 2,000 mmar -40 to 125C -40 to 125C 0 to 360 -40 to 125C -40 to 85C -40 to 85C 2.2 to 3.6 V 1.5 to 3.6 V -25 to 85C 3.3 to 5.5 V 1.5 to 3.6 V 0 to 100% RH 2.9 to 6.0 V 1.5 to 3.6 V Accuracy 3% RH 2 mbar 3% RH, 2 mbar, 1.0C 0.1C 0.2C 0.1 Comm. Interface I2C I2C I2C I2C I2C I2C Board 6 x 2 x 0.1 header 6 x 2 x 0.1 header 6 x 2 x 0.1 header 6 x 2 x 0.1 header 6 x 2 x 0.1 header 6 x 2 x 0.1 header input & output input & output input & output input & output input & output input & output Connections Compatibility Development systems Development systems Development systems Development systems Development systems Development systems compatible with compatible with compatible with compatible with compatible with compatible with Digilent Pmod Digilent Pmod Digilent Pmod Digilent Pmod Digilent Pmod Digilent Pmod connections connections connections connections connections connections WING BOARDS MEAS HTU21D(F) MEAS MS5637 MEAS MS8607 MEAS TSYS01* MEAS TSYS02D* MEAS KMA36(A) Type Humidity Pressure Pressure, Temperature Temperature Angular Position Temperature, Humidity Speci cations 0 to 100% RH 10 to 2,000 mbar 10 to 2,000 mbar -40C to 125C -40C to 125C 0 to 360 -40C to 125C -40 to 85C -40C to 85C 2.2 to 3.6 V 1.5 to 3.6 V -25C to 85C 3.3 to 5.5 V 1.5 to 3.6 V 0 to 100% RH 2.9 to 6.0 V 1.5 to 3.6 V Accuracy 3% RH 2 mBar 3% RH, 2 mBar, 1.0C 0.1C 0.2C 0.1 Comm. Interface I2C I2C I2C I2C I2C I2C Board 10 x 2 x 0.1 header 10 x 2 x 0.1 header 10 x 2 x 0.1 header 10 x 2 x 0.1 header 10 x 2 x 0.1 header 10 x 2 x 0.1 header input & output input & output input & output input & output input & output input & output Connections Compatibility Con gured to operate Con gured to operate Con gured to operate Con gured to operate Con gured to operate Con gured to operate with the Xplained Pro with the Xplained Pro with the Xplained Pro with the Xplained Pro with the Xplained Pro with the Xplained Pro development platform development platform development platform development platform development platform development platform DRIVERS MEAS HTU21D(F) MEAS MS5637 MEAS MS8607 MEAS TSYS01* MEAS TSYS02D* MEAS KMA36(A) Type SAMD2x Microchip SAMD2x Microchip SAMD2x Microchip SAMD2x Microchip SAMD2x Microchip SAMD2x Microchip PIC24x Family PIC24x Family PIC24x Family PIC24x Family PIC24x Family PIC24x Family FPGA Bare Metal - FPGA Bare Metal - FPGA Bare Metal - FPGA Bare Metal - FPGA Bare Metal - FPGA Bare Metal - Linux / Android Linux / Android Linux / Android Linux / Android Linux / Android Linux / Android Language ANSI C Coding ANSI C Coding ANSI C Coding ANSI C Coding ANSI C Coding ANSI C Coding *Temperature System Sensor (TSYS) Series te.com/sensors Speci cations subject to change. Catalog SS-TS-TE100 PAGE 21 Dimensions for reference purpose only. 01/2016 DIGITAL COMPONENT SENSOR DEVELOPMENT TOOLS