MS5840-02BA Low profile, gel-filled, ultra-compact, water resistant digital pressure and temperature sensor There is an increasing demand for sensor components that offer high performance and precision in small spaces. To meet this need TE Connectivity (TE) has designed the MS5840-02BA sensor module with one of the lowest profile footprints in the market (3.3 x 3.3 x 1.7 mm). This ultra-compact, gel-filled pressure and temperature sensor is optimized for applications with small space constraints. TE is a global leader in developing sensor solutions for harsh and complex environments. Our MS5840-2BA is optimized for consumer devices such as fitness trackers, drones and wearables providing a robust sensor package to withstand the harsh environments often encountered in these applications. This MEMS based sensor includes a high-linearity pressure 2 sensor with low power (0.6A), 24-bit digital output (I C) and an altitude resolution at sea level of 13 cm. This enables high resolution measurements such as counting flights of stairs. The board level design delivers sensing accuracy for both pressure (0.5mbar) and temperature (2C) measurements. Our MS5840-02BA provides exceptional performance, reliability and accurate performance from a brand you can trust. FEATURES APPLICATIONS Ceramic and metal package: 3.3 x 3.3 x 1.7mm High-resolution module: 13cm Fitness Trackers Supply voltage: 1.5 to 3.6V Swim Watches Fast conversion down to 0.5ms Shallow Diving Computers Low power, 0.6A (standby 0.1 A at 25C) Drones / Underwater Drones Integrated digital pressure sensor (24-bit ADC) Diving Equipment Operating range: 300 to 1200mbar, -20 to +85C E-cigarettes 2 I C interface Mobile Altimeter/Barometer Systems No external components (internal oscillator) Wearables Shielded metal lid Chlorine resistant option TE CONNECTIVITY SENSORS /// MS5840-02BA REV A5 12/2019 Page 1 MS5840-02BA Low profile, gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min. Typ. Max Unit Supply voltage VDD -0.3 +4 V Storage temperature T -40 +85 C S (1) Overpressure P ISO 22810 10 bar max Maximum Soldering T 40 sec. max 250 C max (2) Temperature ESD rating (lid to GND version) Human Body Model -2 +2 kV JEDEC JESD78 Latch up -100 +100 mA standard (1) Pressure ramp up/down min 60s (2) Refer to application note 808 ELECTRICAL CHARACTERISTICS Parameter Symbol Conditions Min. Typ. Max Unit Operating Supply voltage V 1.5 3.0 3.6 V DD Operating Temperature T -20 +25 +85 C 8192 20.09 4096 10.05 Supply current 2048 5.02 I OSR A DD (1 sample per sec.) 1024 2.51 512 1.26 256 0.63 Peak supply current during conversion 1.25 mA at 25C Standby supply current 0.01 0.1 A (VDD = 3.0 V) Power supply hold off for VDD < 0.1V 200 ms (3) internal reset VDD Capacitor from VDD to GND 100 470 nF Resistor value between the lid Version 02BA2x, 1000 and the GND 02BA3x (3) Supply voltage power up must be continuous from GND to VDD without any step ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. Typ. Max Unit Output Word 24 bit 8192 16.44 17.2 4096 8.22 8.61 2048 4.13 4.32 (4) ADC Conversion time tc OSR ms 1024 2.08 2.17 512 1.06 1.10 256 0.54 0.56 (4) Maximum values must be used to determine waiting times in I2C communication TE CONNECTIVITY SENSORS /// MS5840-02BA REV A6 10/2020 Page 2