Product Information

HTN-B1313

HTN-B1313 electronic component of Thermaltronics

Datasheet
Nozzle: hot air; BGA; Application: HCT-900,TMT-HA200,TMT-HA300
Manufacturer: Thermaltronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 57.9306 ea
Line Total: USD 57.93

1 - Global Stock
Ships to you between
Mon. 20 May to Fri. 24 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
1 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1

Stock Image

HTN-B1313
Thermaltronics

1 : USD 57.9306

Read More Specifications

     
Manufacturer
Product Category
Application
Applications Of Soldering Equipment
Type Of Nozzle
Nozzle Size
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Image Description
HTN-B3030 electronic component of Thermaltronics HTN-B3030

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Additional Infomation About Product

HTN-B1313 is a thermally conductive heat sink from Thermaltronics. It is designed to provide superior cooling performance for high power components that require improved thermal management such as high-power LEDs, ultra-fast switching transistors, and integrated circuits. Constructed of high-grade aluminum with a black anodized finish, it features low thermal impedance, high thermal conductivity, and superior resistance to corrosion. It also has high durability for long-term use, making it ideal for demanding applications. This heat sink can be used with 2-10 W devices.

HS Compliance

Tariff Desc

8515.11.00 11 No - - Soldering irons and guns 5%

8515.19.90 TC 19287262 SOLDERING AND/OR REWORK STATIONS, having ALL of the following:
(a) control unit;
(b) feed station;
(c) ergonomic instruments;
(d) intelligent heat management module;
(e) soldering and rework cartridge tips;
(f) hand piece stands;

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