SSM3K357R MOSFETs Silicon N-Channel MOS SSM3K357R 1. Applications Relay Drivers 2. Features (1) AEC-Q101 Qualified (Note1). (2) 3.0-V gate drive voltage. (3) Built-in Internal Zener diodes and resistors. Note 1: For detail information, please contact to our sales. 3. Packaging and Pin Assignment SOT-23F Start of commercial production 2018-01 2017-2021 2021-01-07 1 Toshiba Electronic Devices & Storage Corporation Rev.4.0SSM3K357R 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T = 25 ) a Characteristics Symbol Rating Unit Drain-source voltage V 60 V DSS Gate-source voltage V 12 GSS Drain current (DC) (Note 1) I 650 mA D Drain current (pulsed) (Note 1), (Note 2) I 1300 DP Power dissipation (Note 3) P 1 W D Power dissipation (t 10 s) (Note 3) P 1.5 D Channel temperature T 150 ch Single-pulse avalanche energy (Note 4) E 12.6 mJ AS Storage temperature T -55 to 150 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Ensure that the channel temperature does not exceed 150 . Note 2: Pulse width (PW) 10 s, duty 1% Note 3: Device mounted on an FR4 board. (25.4 mm 25.4 mm 1.6 mm ,Cu pad: 645 mm2) Note 4: V = 25 V, T = 25 (Initial State), L = 20 mH DD ch Note: The MOSFETs in this device are sensitive to electrostatic discharge. When handling this device, the worktables, operators, soldering irons and other objects should be protected against anti-static discharge. Note: The channel-to-ambient thermal resistance, R , and the drain power dissipation, P , vary according to th(ch-a) D the board material, board area, board thickness and pad area. When using this device, be sure to take heat dissipation fully into account. 2017-2021 2021-01-07 2 Toshiba Electronic Devices & Storage Corporation Rev.4.0