TLP3549,TLP3549F Photocouplers Photorelay TLP3549,TLP3549FTLP3549,TLP3549FTLP3549,TLP3549FTLP3549,TLP3549F 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Mechanical relay replacements Factory Automation (FA) Programmable Logic Controllers (PLCs) Measuring Instruments ATE (Automatic Test Equipment) 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP3549 and TLP3549F photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3549 and TLP3549F make it suitable for power line control applications. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 600 V (min) (3) Trigger LED current: 5.0 mA (max) (4) ON-state current: 0.6 A (max) (A connection) (5) ON-state resistance: 2 (max) (A connection) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) UL-recognized: UL 508, File No.E499232 (Note 1)(Note 1)(Note 1) (Note 2) VDE-approved: EN 60747-5-5 (Note 2)(Note 2)(Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Option (D4) Note 2: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP3549 TLP3549F Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2016-05 2016-2019 2019-11-14 1 Toshiba Electronic Devices & Storage Corporation Rev.5.0TLP3549,TLP3549F 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP3549 TLP3549(LF1,TP1) TLP3549(LF5,TP5) 11-10C405S 11-10C4S 11-10C401S TLP3549F TLP3549F(LF4,TP4) 11-10C404S 11-10C402S Note: Through-hole type: TLP3549, TLP3549F Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. Pin AssignmentPin Assignment 6. 6. Pin AssignmentPin Assignment 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: Drain 6: Source 7: Source 8: Drain 2016-2019 2019-11-14 2 Toshiba Electronic Devices & Storage Corporation Rev.5.0