TLP559(IGM,F) Toshiba

TLP559(IGM,F) electronic component of Toshiba
TLP559(IGM,F) Toshiba
TLP559(IGM,F) High Speed Optocouplers
TLP559(IGM,F)  Optoelectronics
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of TLP559(IGM,F) High Speed Optocouplers across the USA, India, Europe, Australia, and various other global locations. TLP559(IGM,F) High Speed Optocouplers are a product manufactured by Toshiba. We provide cost-effective solutions for High Speed Optocouplers, ensuring timely deliveries around the world.

Part No. TLP559(IGM,F)
Manufacturer: Toshiba
Category: High Speed Optocouplers
Description: High Speed Optocouplers TR HI SPD INTER SHIELD
Datasheet: TLP559(IGM,F) Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.5937
N/A

Obsolete

Availability 0
MOQ : 50
Multiples : 50
QtyUnit Price
50$ 1.7409
100$ 1.5053
500$ 1.3875
1000$ 1.2762
2500$ 1.2762
5000$ 1.2278
10000$ 1.2265
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Current Transfer Ratio
Data Rate
Maximum Forward Diode Voltage
Maximum Reverse Diode Voltage
Maximum Collector Current
Maximum Power Dissipation
Maximum Operating Temperature
Minimum Operating Temperature
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Output Type
Isolation Voltage
Vf - Forward Voltage
If - Forward Current
Vr - Reverse Voltage
Pd - Power Dissipation
Current Transfer Ratio
Input Type
Output Device
Brand
Forward Current
Maximum Continuous Output Current
Maximum Forward Diode Current
Minimum Forward Diode Voltage
Number Of Channels Per Chip
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We are delighted to provide the TLP559(IGM,F) from our High Speed Optocouplers category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TLP559(IGM,F) and other electronic components in the High Speed Optocouplers category and beyond.

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TLP559(IGM) TOSHIBA Photocoupler IRED & Photo IC TLP559(IGM) Transistor Inverters Unit: mm Air Conditioner Inverters Line Receivers Intelligent Power Modules (IPMs) Interfaces The TOSHIBA TLP559(IGM) consists of a high-output infrared emitting diode optically coupled to a high-speed photodiode with a transistor amplifier. The TLP559(IGM) has no internal base connection. The Faraday shield in the photodetector chip provides an effective common-mode noise transient immunity. The TLP559(IGM) guarantees minimum and maximum propagation delay time, a relative time difference between the rise and fall time, and common- mode transient immunity. Therefore, the TLP559(IGM) is suitable for an isolation interface between an Intelligent Power Module (IPM) and a control IC in motor control applications. Isolation Voltage: 2500 Vrms (min) TOSHIBA 11 10C4S Common-Mode Transient Immunity: 10 kV/ s (min) V = 1500 V CM p p Weight: 0.54 g (typ.) Switching Time: t t = 0.1 s (min), = 0.8 s (max) pHL, pLH I = 10 mA, V = 15 V, R = 20 k , Ta = 25C F CC L Switching Time Dispersion: 0.7 s (max) ( tpLHtpHL ) TTL Compatible UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 Pin Configuration (Top view) Schematic 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: Emitter (GND) 6: Collector (Output) 7: N.C. 8: V CC Start of commercial production 1995-01 2019 1 2019-06-24 Toshiba Electronic Devices & Storage Corporation TLP559(IGM) Absolute Maximum Ratings (Ta = 25C) CHARACTERISTIC SYMBOL RATING UNIT Forward Current (Note 1) I 25 mA F Pulse Forward Current (Note 2) I 50 mA FP Peak Transient Forward Current (Note 3) I 1 A FPT Reverse Voltage V 5 V R Diode Power Dissipation (Note 4) P 45 mW D Output Current I 8 mA O Peak Output Current I 16 mA OP Output Voltage V 0.5 to 20 V O Supply Voltage V 0.5 to 30 V CC Output Power Dissipation (Note 5) P 100 mW O Operating Temperature Range T 55 to 100 C opr Storage Temperature Range T 55 to 125 stg C Lead Solder Temperature(10 s) (Note 6) T 260 sol C Isolation Voltage(AC, 60 s, R.H. 60 %) (Note 7) BV 2500 Vrms S Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 1) Derate 0.8 mA above 70 C. (Note 2) 50 % duty cycle, 1 ms pulse width. Derate 1.6 mA/C above 70 C. (Note 3) Pulse width PW 1 s, 300 pps. (Note 4) Derate 0.9 mW/C above 70C. (Note 5) Derate 2 mW/C above 70C. (Note 6) Soldering portion of lead : up to 2mm from the body of the device. (Note 7) Device considers a two-terminal device : pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted together. 2019 2 2019-06-24 Toshiba Electronic Devices & Storage Corporation DETECTOR LED

Tariff Desc

8541.50.00 - Other semiconductor devices (not IC) semiconductor devices
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
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