XPH4R714MC MOSFETs Silicon P-Channel MOS (U-MOS) XPH4R714MCXPH4R714MCXPH4R714MCXPH4R714MC 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Automotive Switching Voltage Regulators DC-DC Converters Motor Drivers 2. 2. 2. 2. FeaturesFeaturesFeaturesFeatures (1) AEC-Q101 qualified (2) Small, thin package (3) Low drain-source on-resistance: R = 3.6 m (typ.) (V = -10 V) DS(ON) GS (4) Low leakage current: I = -10 A (max) (V = -40 V) DSS DS (5) Enhancement mode: V = -1.0 to -2.1 V (V = -10 V, I = -1 mA) th DS D 3. 3. Packaging and Internal CircuitPackaging and Internal Circuit 3. 3. Packaging and Internal CircuitPackaging and Internal Circuit 1, 2, 3: Source 4: Gate 5, 6, 7, 8: Drain SOP Advance(WF) Start of commercial production 2019-06 2018-2020 2020-06-24 1 Toshiba Electronic Devices & Storage Corporation Rev.4.0XPH4R714MC 4. 4. 4. 4. Absolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (T = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) aaaa Characteristics Symbol Rating Unit Drain-source voltage V -40 V DSS Gate-source voltage V +10/-20 GSS Drain current (DC) (Note 1) I -60 A D Drain current (pulsed) (Note 1) I -180 DP Power dissipation (T = 25 ) P 132 W c D Power dissipation (t = 10 s) (Note 2) 3 Power dissipation (t = 10 s) (Note 3) 0.96 Single-pulse avalanche energy (Note 4) E 138 mJ AS Single-pulse avalanche current I -60 A AS Channel temperature (Note 5) T 175 ch Storage temperature (Note 5) T -55 to 175 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 5. 5. Thermal CharacteristicsThermal Characteristics 5. 5. Thermal CharacteristicsThermal Characteristics Characteristics Symbol Max Unit Channel-to-case thermal impedance (T = 25 ) z 1.13 /W c th(ch-c) Channel-to-ambient thermal impedance (t = 10 s) (Note 2) z 50 th(ch-a) Channel-to-ambient thermal impedance (t = 10 s) (Note 3) z 156 th(ch-a) Note 1: Ensure that the channel temperature does not exceed 175 . Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1 Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2 Note 4: V = -25 V, T = 25 (initial), L = 40 H, R = 25 , I = -60 A, V = 0/-15 V DD ch G AS GS Note 5: The definitions of the absolute maximum channel and storage temperatures are qualified per AEC-Q101. Fig. 5.1 Device Mounted on a Glass-Epoxy Fig. 5.2 Device Mounted on a Glass-Epoxy Fig. Fig. Fig. 5.15.15.1 Device Mounted on a Glass-Epoxy Device Mounted on a Glass-Epoxy Device Mounted on a Glass-Epoxy Fig. Fig. Fig. 5.25.25.2 Device Mounted on a Glass-Epoxy Device Mounted on a Glass-Epoxy Device Mounted on a Glass-Epoxy Board (a) Board (b) Board (a)Board (a)Board (a) Board (b)Board (b)Board (b) Note: This transistor is sensitive to electrostatic discharge and should be handled with care. 2018-2020 2020-06-24 2 Toshiba Electronic Devices & Storage Corporation Rev.4.0