TE0741-03-325-2IF Trenz Electronic

TE0741-03-325-2IF electronic component of Trenz Electronic
TE0741-03-325-2IF Trenz Electronic
TE0741-03-325-2IF System-On-Modules - SOM
TE0741-03-325-2IF  Embedded Solutions
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X-On Electronics has gained recognition as a prominent supplier of TE0741-03-325-2IF System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0741-03-325-2IF System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.

Part No. TE0741-03-325-2IF
Manufacturer: Trenz Electronic
Category: System-On-Modules - SOM
Description: System-On-Modules - SOM FPGA Module with Xilinx Kintex-7 XC7K325T-2IF 4 x 5 cm standard footprint
Datasheet: TE0741-03-325-2IF Datasheet (PDF)
Price (USD)
1: USD 1146.9998 ea
Line Total: USD 1147 
Availability : 0
  
QtyUnit Price
1$ 1146.9998

Availability 0
Ship by Wed. 08 Oct to Fri. 10 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1146.9998

   
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We are delighted to provide the TE0741-03-325-2IF from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0741-03-325-2IF and other electronic components in the System-On-Modules - SOM category and beyond.

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TE0741 TRM Revision: V.64 Exported on: 08/29/2018TE0741 TRM V.64 1 Table of Contents 1 Table of Contents........................................................................................................................................... 2 2 Overview......................................................................................................................................................... 4 2.1 Key Features................................................................................................................................................... 4 2.2 Block Diagram ................................................................................................................................................ 5 2.3 Main Components.......................................................................................................................................... 5 2.4 Initial Delivery State....................................................................................................................................... 7 3 Signals, Interfaces and Pins........................................................................................................................... 8 3.1 Board to Board (B2B) I/Os ............................................................................................................................. 8 3.2 JTAG Interface................................................................................................................................................ 8 3.3 System Controller I/O Pins ............................................................................................................................ 9 3.4 On-board LEDs ............................................................................................................................................... 9 3.5 Clocking ........................................................................................................................................................ 10 4 On-board Peripherals .................................................................................................................................. 11 4.1 Programmable PLL Clock (Phase-Locked Loop)........................................................................................ 11 4.2 32 MByte Quad SPI Flash Memory............................................................................................................... 12 4.3 GTX Transceivers.......................................................................................................................................... 12 4.4 System Controller CPLD .............................................................................................................................. 12 5 Power and Power-On Sequence ................................................................................................................. 14 5.1 Power Supply ............................................................................................................................................... 14 5.2 Power-On Sequence .................................................................................................................................... 14 5.3 Power Rails................................................................................................................................................... 14 5.4 Bank Voltages............................................................................................................................................... 15 6 Board to Board Connectors......................................................................................................................... 16 6.1 Connector Mating height ............................................................................................................................. 16 6.2 Connector Speed Ratings ............................................................................................................................ 16 6.3 Current Rating .............................................................................................................................................. 16 6.4 Connector Mechanical Ratings.................................................................................................................... 16 6.5 Manufacturer Documentation..................................................................................................................... 17 7 Variants Currently In Production ................................................................................................................ 18 8 Technical Specifications.............................................................................................................................. 19 8.1 Absolute Maximum Ratings......................................................................................................................... 19 8.2 Recommended Operating Conditions ........................................................................................................ 19 8.3 Operating Temperature Ranges.................................................................................................................. 19 8.4 Physical Dimensions .................................................................................................................................... 20 Copyright 2018Trenz Electronic GmbH 2 of 24

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
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