TE0803-03-3BE11-A Trenz Electronic

TE0803 TRM Revision: v.30 Exported on: 01/04/2021TE0803 TRM v.30 1 Table of Contents 1 Table of Contents..................................................................................................................................................... 2 2 MGT Lanes ................................................................................................................................................................ 4 3 Overview................................................................................................................................................................... 5 3.1 Key Features............................................................................................................................................................. 5 3.2 Block Diagram .......................................................................................................................................................... 6 3.3 Main Components .................................................................................................................................................... 7 3.4 Initial Delivery State................................................................................................................................................. 8 4 Signals, Interfaces and Pins..................................................................................................................................... 9 4.1 Board to Board (B2B) connectors ........................................................................................................................... 9 4.2 MGT Lanes .............................................................................................................................................................. 10 4.3 JTAG Interface ........................................................................................................................................................ 12 4.4 Configuration Bank Control Signals...................................................................................................................... 13 4.5 Analog Input ........................................................................................................................................................... 13 4.6 Quad SPI Interface ................................................................................................................................................. 13 5 Boot Process........................................................................................................................................................... 15 6 On-board Peripherals ............................................................................................................................................ 16 6.1 Flash........................................................................................................................................................................ 16 6.2 DDR4 SDRAM .......................................................................................................................................................... 16 6.3 Configuration EEPROM .......................................................................................................................................... 16 6.4 Programmable PLL Clock Generator .................................................................................................................... 16 6.5 Clocking .................................................................................................................................................................. 17 6.6 On-board LEDs ....................................................................................................................................................... 17 7 Power and Power-On Sequence............................................................................................................................ 18 7.1 Power Consumption .............................................................................................................................................. 18 7.2 Power Distribution Dependencies ........................................................................................................................ 18 7.3 Power-On Sequence Diagram ............................................................................................................................... 20 7.4 Operation Conditions of the DC-DC Converter Control Signals........................................................................... 21 7.5 Voltage Monitor Circuit .......................................................................................................................................... 22 7.6 Power Rails ............................................................................................................................................................. 23 7.7 Bank Voltages......................................................................................................................................................... 23 8 B2B connectors ...................................................................................................................................................... 25 8.1 Features.................................................................................................................................................................. 25 8.2 Connector Stacking height .................................................................................................................................... 25 8.3 Current Rating ........................................................................................................................................................ 26 8.4 Connector Speed Ratings ...................................................................................................................................... 26 Copyright 2021Trenz Electronic GmbH 2 of 34