TE0841-02-32I21-A Trenz Electronic

TE0841 TRM Revision: v.62 Exported on: 07/10/2018TE0841 TRM v.62 1 Table of Contents 1 Table of Contents........................................................................................................................................ 2 2 Overview...................................................................................................................................................... 4 2.1 Key Features................................................................................................................................................ 4 2.2 Block Diagram ............................................................................................................................................. 5 2.3 Main Components....................................................................................................................................... 6 2.4 Initial Delivery State.................................................................................................................................... 6 3 Boot Process................................................................................................................................................ 7 4 Signals, Interfaces and Pins........................................................................................................................ 8 4.1 Board to Board (B2B) I/Os .......................................................................................................................... 8 4.2 MGT Lanes ................................................................................................................................................... 8 4.3 JTAG Interface............................................................................................................................................. 9 4.4 System Controller CPLD I/O Pins.............................................................................................................. 10 4.5 Quad SPI Interface .................................................................................................................................... 11 4.6 I2C Interface .............................................................................................................................................. 11 5 On-board Peripherals ............................................................................................................................... 12 5.1 System Controller CPLD ........................................................................................................................... 12 5.2 DDR Memory.............................................................................................................................................. 12 5.3 Quad SPI Flash Memory............................................................................................................................ 12 5.4 Programmable Clock Generator .............................................................................................................. 12 5.5 Oscillators.................................................................................................................................................. 13 5.6 On-board LEDs .......................................................................................................................................... 13 6 Power and Power-On Sequence .............................................................................................................. 14 6.1 Power Consumption ................................................................................................................................. 14 6.2 Power Distribution Dependencies ........................................................................................................... 15 6.3 Power-On Sequence ................................................................................................................................. 16 6.4 Power Rails................................................................................................................................................ 17 6.5 Bank Voltages............................................................................................................................................ 17 7 Board to Board Connectors...................................................................................................................... 18 7.1 Connector Mating height .......................................................................................................................... 18 7.2 Connector Speed Ratings ......................................................................................................................... 18 7.3 Current Rating ........................................................................................................................................... 18 7.4 Connector Mechanical Ratings................................................................................................................. 18 7.5 Manufacturer Documentation.................................................................................................................. 19 8 Variants Currently In Production ............................................................................................................. 20 Copyright 2018Trenz Electronic GmbH 2 of 26