Resistors Cylindrical High Power Metal Glaze thick film element fired at 1000C SurfCHPace Mount Metal Glaze to solid ceramic Cylindrical High Power CHP Series TM Surface Mount Metal Glaze Up to 2 watts TM Metal Glaze Up to 1000 volts thick lm element red at 1000C High to solid ceramic 0.2 ohm to 2.2 megohm range temperature Up to 2 watts dielectric RoHS-compliant version available coating Up to 1000 volts 150C maximum operating temperature 0.2 ohm to 2.2 megohm range Solder over High nickel barrier temperature RoHS-compliant version available dielectric coating 150C maximum operating temperature Solder over All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2) nickel barrier Electrical Data Indus- IRC try Size Maximum Working Maximum Resistance Product Tolerance TCR 1 Type Foot- Code Power Rating Voltage Voltage Range (ohms) Category (%) (ppm/C) print 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1/8 1206 B & C 1/4W 70C 200 400 1.0 to 1.0 M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1/2 2010 D & E 1/2W 70C 300 600 1.0 to 348K Standard 1, 2, 5 50, 100 0.1 to 0.99 Low Range 1, 2, 5 100 CHP 1 2512 F 1W 70C 350 700 1.0 to 2.21M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 0.2 to 0.99 Low Range 1, 2, 5 100 2W 25C CHP 2 3610 H 500 1000 1.33W 70C 1.0 to 2.21M Standard 1, 2, 5 50, 100 See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging. Not to exceed P x R Con sult factory for tighter TCR, tolerance, or resistance values. Environmental Data Characteristics Maximum Change Test Method Characteristics Maximum Change Test Method MIL-PRF-55342H, 4.8.3 Thermal Shock 0.25% +.01 Temperature Coef cient As speci ed MIL-R-55342H (MIL-STD-202, Method 107G: +150C / -65C)Par 3.16 (-55C + 125C) MIL-PRF-55342H, 4.8.5 Thermal Shock 0.5% + 0.01 ohm MIL-R-55342H Par 3.9 (-65C + 150C, 5 cycles) Low Temperature Operation 0.25% +.01 (-65C) Low Temperature Operation 0.25% + 0.01 ohm MIL-R-55342H Par 3.11 (-65C working voltage) 0.5% +.01 Short Time Overload MIL-PRF-55342H, 4.8.6 1% for R>100K 0.5% + 0.01 ohm MIL-R-55342H Par 3.12 Short Time Overload MIL-PRF-55342H, 4.8.7 1% for R>100K ohm 2.5 x P x R for 5 seconds High Temperature Exposure 0.5% +.01 (150C x 100 Hours) High Temperature Exposure 0.5% + 0.01 ohm MIL-R-55342H Par 3.13 (-150C for 100 hours) Resistance to Bonding Exposure 0.25% +.01 MIL-PRF-55342H, 4.8.8.2 Resistance to Bonding 0.25% + 0.01 ohm MIL-R-55342H MIL-PRF-55342H, 4.8.8.2Par 3.14.2 (Re ow soldered to board at 260C for 10 seconds) Moisture Resistance 0.5% +.01 (MIL-STD-202, Method 106G) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245C for 5 seconds) MIL-PRF-55342H, 4.8.10 Temperature Coefficient As specified (MIL-STD-202, Method 304) Solderability 0.5% + 0.01 ohm MIL-R-55342H Par 3.18 (10 cycles, total 240 hours) MIL-PRF-55342H, 4.8.11 Life Test 1% +.01 (MIL-STD-202, Method 108A: 2000 Hours 70C) Moisture Resistance 0.5% + 0.01 ohm MIL-R-55342H Par 3.15 (2000 hours at 70C intermittent) MIL-PRF-55342H, 4.8.12 SolderabilityLife Test 1% + 0.01 ohm95% minimum coverage 1200 (MIL-STD-202, Method 208H)gram push from underside of mounted chip for 60 seconds Terminal Adhesion Strength no mechanical damage 1% +.01 IRC defined Terminal Adhesion Strength (push) 1% + 0.01 ohm Chip mounted in center of 90mm long board, de ected 1mm so as to (no mechanical damage) 1200 gram push from underside of mounted device for 60 sec no mechanical damage exert pull on chip contacts for 5 seconds IRC-defined 1% +.01 General NoteTerminal Adhesion Strength (flex) Device mounted in center of 90mm long board, deflected 1 mm to exert (no mechanical damage) IRC reserves the right to make changes in product speci cation without notice or liability. pull on contacts for 5 seconds All information is subject to IRCs own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc IRC Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA General Note Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com CHP Series Issue March 2011 Sheet 1 of 3 BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print. Cylindrical High Power CHP Surface Mount Metal Glaze Cylindrical High Power CHP Series TM Surface Mount Metal Glaze Physical Data L C W Dimensions (Inches and (mm)) Industry IRC Type Size Code Footprint Actual Size L W C 0.128 0.007 0.057 0.006 0.020 0.010 CHP 1/8 B 1206 (3.25 0.18) (1.45 0.15) (0.51 0.25) 0.079 (nom.) -0.006 / +0.011 0.200 0.010 0.030 0.010 CHP 1/2 D 2010 (2.01 (nom.) -0.15 / +0.28) (5.08 0.25) (0.761 0.25) 0.079 (nom.) -0.006 / +0.011 0.251 0.010 0.040 0.010 CHP 1 F 2512 (6.38 0.25) (1.02 0.25) (2.01 (nom.) -0.15 / +0.28) 0.105 (nom.) -0.006 / +0.011 0.367 0.010 0.050 0.010 CHP 2 H 3610 (9.32 0.25) (2.67 (nom.) -0.15 / +0.28) (1.27 0.25) Recommended Solder Pad Dimensions (Re ow): F A C A B E D Dimensions (Inches and mm)) Size Industry Code Footprint ABC D E F 0.076 0.093 0.058 0.098 0.032 0.211 B & C 1206 (1.93) (2.36) (1.47) (2.49) (0.81) (5.36) 0.111 0.126 0.096 0.152 0.040 0.318 D 2010 (2.82) (3.20) (2.44) (3.86) (1.02) (8.08) 0.170 0.160 0.072 0.132 0.044 0.412 E 2010 (4.32) (4.06) (1.83) (3.35) (1.12) (10.46) 0.121 0.126 0.127 0.183 0.040 0.369 F 2512 (3.07) (3.20) (3.23) (4.65) (1.02) (9.37) 0.170 0.160 0.213 0.273 0.044 0.553 H 3610 (4.32) (4.06) (5.41) (6.93) (1.12) (14.05) IRC Wire and Film Technologies Division 4222 South Staples Street Corpus Christi Texas 78411 USA CHP Series Issue March 2011 Sheet 2 of 3 Telephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com General Note BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print.