Resistors Low Resistance Metal Alloy Resistor LRMA Series Resistance range 0.5m to 500m Low Resistance Metal Alloy Resistor High temperature operation to 170C Low thermal EMF version LRMA Series High p ower version Resistance range1to100m Current sensing for power electronics Hightemperature operationto170C RoHS compliant & halogen free LowthermalEMF version AEC-Q200 qualified Highpowerversion Currentsensingforpowerelectronics RoHS compliant&halogenfree AllAll partsparts araree Pb-Pb-frfreeee andand ccomplyomply withwith EUEU DirDirectivectivee 2011/65/EU2011/65/EU amendedamended bbyy (EU)(EU) 2015/8632015/863 (R(RoHS3)oHS3) Electrical Data LRMAVersion T (Standard) P(Power) Size 2512 2010 2512 Power rating 70C W 1.5 R01: 2, >R01: 1 R10: 3, >R10: 2 Overload rating (5s) W R01: 10, >R01: 5 7.5 R10: 15, >R10: 10 Resistance range m 2 to 50 1 to 100 0.5 to 500 1 0.5, 0.75, 1, 1.1, 1.5, 2, 2.5, 3, 4, 5, 6, 6.8, 7, 8, 9, 10, 11, 12, 13, 15, 18, 20, Standard values m 1, 1.5, 2, 3, 3.5, 4, 5, 6, 7, 8, 10, 11, 12, 2, 5, 6, 10, 22,25, 27, 30, 33, 39, 40, 45, 47, 50, 57, 60, 68, 70, 75, 80, 85, 90,100, 15, 18, 20, 25, 30, 33, 35, 40, 50, 100 15, 20, 50 120, 130, 140, 150, 180, 200, 220, 240, 250, 270, 280, 300, 330, 390, 400, 500 1 Resistance tolerance % 0.5 , 1, 5 TCR (25 to 125C) ppm/C R01: 75 >R001 &<R01: 100, R001: 275 <R001: 200 R001: 50 Ambient temperature C -55 to 170 Insulation resistance M >100 Element alloy Cu-Ni Cu-Ni / Mn-Cu LRMAVersion M(Low thermal EMF) N(Inverse) Size 0805 1206 2512 0612 0815 1225 2 Power rating 70C W 0.5 1 R01: 2, >R01: 1 1 3 Overload rating (5s) W 2.5 5 R01: 10, >R01: 5 5 15 Resistance range m 1 to 25 1 to 50 0.5 to 50 1 to 10 3 to 30 2 to 40 1 1, 2, 3, 5, 6, 8, 1, 1.2, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 0.5, 0.75, 1, 1.5, 2, 3.5, 5, 3, 4, 5, 10, 2,3,4,5,10,15, Standard values m 1, 3, 5, 10 9,10, 20, 25 15, 18, 20, 22, 25, 30, 39, 40, 50 15, 20, 25, 30 20,25,30,40 10, 20, 25, 30, 40, 50 1 Resistance tolerance % 0.5 , 1, 5 R01: 75, >R001 & 50 TCR (25 to 125C) ppm/C 100 100 <R01: 100 R001: 275 Ambient temperature -55 to 170C Insulation resistance M >100 Element alloy Mn-Cu Mn-Cu / Cu-Ni 2 Notes: 1. Non-standard values and 0.5% tolerance may be available for high volume requirements. 2. Requires 300mm copper pad & trace area Physical Data (All dimensions in mm and nominal weight in mg) Size L W C t Wt 0805 0.4 0.2 2.0 0.1 1.25 0.1 0.6 0.2 5.5 0805 R002 0.6 0.2 1206 <R002 1.1 0.3 0.75 0.2 3.2 0.2 1.6 0.2 18.3 1206 R002 0.5 0.3 0.6 0.2 1.70.2 3.20.2 0.40.2 0.6 0.2 12.9 0612 2.1 0.25 3.75 0.3 0.5 0.2 0.7 0.2 14.1 0815 5.0 0.2 2.5 0.2 0.6 0.3 2010 0.6 0.2 35.6 2512 <R001 2.6 0.2 1 6.4 0.2 3.2 0.2 0.65 0.25 57 to 63 R001 & R003 2.0 0.2 2512 1 2512 >R003 0.9 0.2 3.2 0.3 6.4 0.3 0.9 0.2 70 1225 0.5 0.2 Note 1 - This applies to LRMAT2512 and LRMAM2512. For LRMAP2512 this threshold is R004 General Note BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors TT Electronics plc 12.20Resistors Low Resistance Metal Alloy Resistor Low Resistance Metal Alloy Resistor LRMA Series LRMA Series Construction Coating(UL94-V0) Copperelectrodewith LowTCR nickel thentinplating resistancealloyplate Marking The components are marked with ohmic value, e.g. R002 = 2m, R010 = 10 m. Due to space restrictions, for LRMAM1206-R001,01 = 1m is used, and for LRMAM0805, 2 = 2m, 010 = 10 m are used. SolventResistance The component is resistant to all normal industrial cleaning solvents suitable for printed circuits. Performance Data Maximum(%) Typical(%) Load at rated power (cyclic load, 1000 hours at 70C) R 0805: 1.5 Others 1 0.3 Short term overload (5 x rated power for 5s) R 0.5 0.15 Humidity (1000 hours, 85C, 85%RH) R 0805: 1 Others 0.5 0.15 Temperature cycle (-40 to +125C, 1000 cycles, 15 minute dwell) R 0805: 1 Others 0.5 0.15 Resistance to solder heat (260C 5C for 20s 1s) R 0.5 0.3 Solderability (245C 5C for 2s 0.5s) >95% coverage Dry heat (1000 hours at 170C) R 0805: 1.5 Others 0.5 0.3 Low temperature storage (1000 hours at -55C) R 0.5 0.15 Substrate bending (board 1.6mm, fulcrum spacing 90mm, deflection 2mm) R 0805: 1 Others 0.5 0.3 Insulation resistance (1 minute 100Vdc) >100M ThermalPerformance&Mounting TemperatureDerating TypicalTemperatureRise 120 100% Hotspot 100 80% 80 60% 60 40 40% Joint 20 20% 0 0% 0% 20% 40% 60% 80% 100% -30 20 70 120 170 Proportion ofPr Ambient Temperature (C) L b ReferencePad Dimensions(mm) The temperature rise shown is highly Size a b L dependent on mounting conditions. 0612 3.8 0.7 0.7 Reference conditions assume 20 1.4 1.15 1.2 0805 a copper with thermal vias to multiple 1206 <R002 1.8 2.3 1.0 1206 R002 layers. 1.8 1.7 1.6 7.9 1.5 0.9 The self-heating in the current tracks 0815 3.4 1.5 3.5 should be kept negligible, or allowed 2010 1 4.0 3.1 1.3 for by temperature derating. 2512 R003 Current Sense 1 2512 >R003 4.0 2.1 4.1 1225 7.0 1.0 2.3 Note 1 - This applies to LRMAT2512 and LRMAM2512. For LRMAP2512 this threshold is R004 Standard 4-terminal probe pitches for measuring unmounted parts are 2.8 x 1.7mm (0612), 0.4 x 1.83mm (0805), 0.4 x 2.8mm (1206), 1.2 x 4.5mm (2010), 1.5 x 5.8mm (2512), and 5.4 x 3.4mm (1225). All probe location tolerances 0.02mm. General Note BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors TT Electronics plc 12.20 Proportion of Pr TemperatureRise (C)