Product Information

LPH0001

LPH0001 electronic component of Versarien

Datasheet
Heat Sinks Heat Sink, Low Profile, Metallic VersarienCu Foam, 10x10x2mm
Manufacturer: Versarien
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 9.8516 ea
Line Total: USD 9.85

270 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
111 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

LPH0001
Versarien

1 : USD 8.5713
10 : USD 8.4842
25 : USD 8.0107
50 : USD 7.6121
100 : USD 7.2632
250 : USD 6.7774
500 : USD 6.715
1000 : USD 6.6403
2500 : USD 6.5032

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
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Cnhts
Hts Code
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Additional Infomation About Product

Low Profile Metallic Foam Heat Sinks Introducing the next generation of low profile heat sinks from Versarien Technologies. Using the incredible new material VersarienCu, a The copper foam is coated with a thin, hard layer micro-porous metallic copper foam, Versariens heat of high temperature copper oxide that improves the sinks offer unparalleled thermal performance in low emissivity of the foam to improve its radiant properties profile applications. and reduce the temperature of your component. The large surface area created by the interconnected This range is designed for use in passive cooling pores of the foam coupled with the excellent thermal applications where space is at a premium and conductivity of copper allows for the height of performance is crucial. VersarienCu heat sinks can your heat sinks to be reduced, without sacrificing be used to cool any IC component. performance. Contact us today to find out more e: sales versarien.com t: +44 (0) 1594 888 622 w: www.versarien-technologies.co.uk 2015 Versarien Technologies Low Profile Heatsinks Rev 02 -10-03-2015Low Profile Metallic Foam Heat Sinks PRODUCT LPH0001 10x10x2 LPH0002 15x15x2 LPH0003 20x20x2.5 LPH0004 20x20x5 LPH0005 25x25x2.5 LPH0006 25x25x5 LPH0007 30x30x2.5 LPH0008 30x30x5 LPH0009 40x40x2.5 LPH0010 40x40x5 Performance Testing of 40X40 Low Profile Heat Sinks 35 Blank (No Heat Sink) 30 Micro-Porous Ceramic Heat Sink 2.5mm Aluminium Finned Heat Sink 5mm Versarien Copper Foam 2.5mm Versarien Copper Foam 5mm 25 Comparison testing of Versarien 63 % copper foam (solid lines) to market leading low profile ceramic and finned aluminium heat sinks (dashed lines). 20 Data presented is thermal resistance (C/W) vs applied power (W). Testing performed concurrently in still air with insulated load resistors. 15 1W 3W 5W Power (W) Comparative heatmap of a 40x40x2.5 microporous ceramic and VersarienCu heat sink at 5W. The Versarien heat sink is 6.10C/W cooler. At an applied load of 5W the thermal resistance of a 40x40x5 (mm) Versarien heat sink is 17.4 C/W Versarien At an applied load of 2W the thermal resistance of a 117.10C 20x20x5 (mm) Versarien heat sink is 35.8 C/W MPC 123.20C Contact us today to find out more e: sales versarien.com t: +44 (0) 1594 888 622 w: www.versarien-technologies.co.uk 2015 Versarien Technologies Low Profile Heatsinks Rev 02 -10-03-2015 APPLICATION POWER IC HIGH TEMP. COMPONENT TRANSISTOR STB AP ROUTER G PON CABLE MODEM BROADBAND VOIP LED TV LED TV (SCALAR IC) Thermal Resistance (0C/W)

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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